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公开(公告)号:US10923023B1
公开(公告)日:2021-02-16
申请号:US15380860
申请日:2016-12-15
Applicant: Apple Inc.
Inventor: Andreas Bibl , Xia Li , John A. Higginson , Vaibhav D. Patel , Kapil V. Sakariya , Imran Hashim , Tore Nauta , Thomas Charisoulis
Abstract: Hybrid chiplets, display backplanes, and displays with integrated hybrid chiplets are described. In an embodiment, a hybrid chiplet includes a micro LED chiplet stacked on a micro driver chiplet that includes at least one drive transistor and a bottom side including a plurality of bottom chiplet contacts for electrical connection with a display backplane.
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公开(公告)号:US20230087088A1
公开(公告)日:2023-03-23
申请号:US17894935
申请日:2022-08-24
Applicant: Apple Inc.
Inventor: Mahdi Farrokh Baroughi , Sandeep Chalasani , Xiang Lu , Anurag Mehta , Hopil Bae , Chaohao Wang , Rajesh Velayuthan , Steven E. Molesa , Yaser Azizi , Young Don Bae , Sunmin Jang , Haitao Li , Hari P. Paudel , Anatole Huang , Tyler R. Kakuda , David A. Doyle , Wei H. Yao , Majid Gharghi , Vaibhav D. Patel
Abstract: A display may be formed by an array of light-emitting diodes mounted to the surface of a display substrate. The light-emitting diodes may be inorganic light-emitting diodes formed from separate crystalline semiconductor structures. An array of pixel control circuits may be used to control light emission from the light-emitting diodes. Each pixel control circuit may be configured to control one or more respective passive matrices. To control partial pixel cells in the display, a donor pixel control circuit in a partial pixel cell may control the pixels in a receptor partial pixel cell without a pixel control circuit. To mitigate the size of an inactive area of the display, fanout signal lines for the display may be formed in the light-emitting active area of the display. The fanout signal lines may be formed between a row of pixel control circuits and a bottom edge of the light-emitting active area.
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公开(公告)号:US20210213587A1
公开(公告)日:2021-07-15
申请号:US17071865
申请日:2020-10-15
Applicant: Apple Inc.
Inventor: Vaibhav D. Patel , John P. Staton , Jonathan M. Manzano , Stephen P. Bathurst
Abstract: Multi-port polishing fixture assemblies, pick and place bond heads, split holders, and conditioning methods are described. In an embodiment, a multi-port polishing fixture assembly includes a fixture base, a plurality of split holders fastenable to a perimeter surface with a plurality of kinematic plurality of kinematic clamps. The pick and place bond heads may be secured inside the plurality of split holders to reduce edge-fast polishing during conditioning of the distal bond surfaces of the pick and place bond heads.
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公开(公告)号:US20190006329A1
公开(公告)日:2019-01-03
申请号:US16067865
申请日:2017-01-11
Applicant: Apple Inc.
Inventor: Imran Hashim , Vaibhav D. Patel , Hsin-Hua Hu , Kapil V. Sakariya , Ralph E. Kauffman
IPC: H01L25/075 , H01L33/62 , H01L33/44
Abstract: Display integration schemes are described for passivating LEDs and providing conductive terminal connections. In accordance with embodiments, a sidewall passivation layer is formed around the LEDs. The sidewall passivation layer may or may not be contained within a well structure. A top electrode layer is formed to electrically connect the LEDs to conductive terminal routing.
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