公开(公告)号：US11107208B2

公开(公告)日：2021-08-31

申请号：US16581683

申请日：2019-09-24

Applicant: Apple Inc.

Inventor： Patrick J. Czarnota ,  Paul Argus Parks ,  Nile A. Light ,  Stephen P. Bathurst ,  John H. Higginson ,  Stephen R. Deming ,  Robert B. Martin ,  Tsan Y. Chan ,  Andreas Bibl

IPC: G06K9/00 ,  G06T7/00

Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.

公开(公告)号：US10438339B1

公开(公告)日：2019-10-08

申请号：US15695953

申请日：2017-09-05

Applicant: Apple Inc.

Inventor： Patrick J. Czarnota ,  Paul Argus Parks ,  Nile A. Light ,  Stephen P. Bathurst ,  John H. Higginson ,  Stephen R. Deming ,  Robert B. Martin ,  Tsan Y. Chan ,  Andreas Bibl

IPC: G06K9/00 ,  G06T7/00

Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.

公开(公告)号：US20170182667A1

公开(公告)日：2017-06-29

申请号：US15460915

申请日：2017-03-16

Applicant: Apple Inc.

Inventor： Stephen P. Bathurst ,  Paul Argus Parks ,  Nile Alexander Light

IPC: B25J15/00 ,  B25J19/02 ,  B25J7/00 ,  H01L21/683 ,  H02N13/00

CPC classification number: B81C99/002 ,  B25J7/00 ,  B25J15/0085 ,  B25J19/02 ,  B81B2203/0163 ,  H01L21/6831 ,  H02N13/00 ,  Y10T74/20006

Abstract: Systems and methods for aligning a transfer head assembly with a substrate are disclosed. In an embodiment a pivot mount is used for generating a feedback signal in a closed-loop motion control system. In an embodiment, the pivot mount includes a plurality of spring arms, with each spring arm including a switch-back along an axial length of the spring arm such that a pair of first and second lengths of the spring arm are immediately adjacent the switch-back and are parallel to each other. A first strain sensing element is located at the first length, and a second strain sensing element is located at the second length.

公开(公告)号：US20200020095A1

公开(公告)日：2020-01-16

申请号：US16581683

申请日：2019-09-24

Applicant: Apple Inc.

Inventor： Patrick J. Czarnota ,  Paul Argus Parks ,  Nile A. Light ,  Stephen P. Bathurst ,  John H. Higginson ,  Stephen R. Deming ,  Robert B. Martin ,  Tsan Y. Chan ,  Andreas Bibl

IPC: G06T7/00

Abstract: An optical verification method and mass transfer system described. In an embodiments, a mass transfer sequence may be accompanied by optical imaging and inspection to detect pick and place errors. The optical imaging and inspection techniques may be performed in-situ.

公开(公告)号：US10150669B2

公开(公告)日：2018-12-11

申请号：US15460915

申请日：2017-03-16

Applicant: Apple Inc.

Inventor： Stephen P. Bathurst ,  Paul Argus Parks ,  Nile Alexander Light

IPC: B81C99/00 ,  H01L21/683 ,  H02N13/00 ,  B25J7/00 ,  B25J15/00 ,  B25J19/02

Abstract: Systems and methods for aligning a transfer head assembly with a substrate are disclosed. In an embodiment a pivot mount is used for generating a feedback signal in a closed-loop motion control system. In an embodiment, the pivot mount includes a plurality of spring arms, with each spring arm including a switch-back along an axial length of the spring arm such that a pair of first and second lengths of the spring arm are immediately adjacent the switch-back and are parallel to each other. A first strain sensing element is located at the first length, and a second strain sensing element is located at the second length.

公开(公告)号：US20180194014A1

公开(公告)日：2018-07-12

申请号：US15839691

申请日：2017-12-12

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Paul A. Parks ,  Stephen P. Bathurst ,  Jon A. Williams ,  John A. Higginson ,  Shenshen Zhao

IPC: B25J15/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/68 ,  H01L21/683

CPC classification number: B25J15/0085 ,  B25J7/00 ,  B25J15/0033 ,  B25J15/0052 ,  B25J15/0408 ,  H01L21/67144 ,  H01L21/67288 ,  H01L21/67721 ,  H01L21/68 ,  H01L21/683

Abstract: Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.

公开(公告)号：US20240234181A1

公开(公告)日：2024-07-11

申请号：US18562211

申请日：2022-05-17

Applicant: Apple Inc.

Inventor： Mingjing Ha ,  Kuan H. Lu ,  Paul S. Drzaic ,  Peter T. Carmichael ,  Siyi Liu ,  Yung-Yu Hsu ,  Stephen P. Bathurst ,  Kevin T. Huang

IPC: H01L21/67 ,  H01L21/687 ,  H01L25/075

CPC classification number: H01L21/67144 ,  H01L21/6875 ,  H01L21/68778 ,  H01L21/68757 ,  H01L25/0753

Abstract: Conformable transfer devices and micro-transfer printing methods are described. In an embodiment, a conformable transfer devices includes first and second arrays of transfer heads with differential lengths to support a micro-transfer printing sequence including a single pick operation and multiple placement operations.

公开(公告)号：US10814496B2

公开(公告)日：2020-10-27

申请号：US15839691

申请日：2017-12-12

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Paul A. Parks ,  Stephen P. Bathurst ,  Jon A. Williams ,  John A. Higginson ,  Shenshen Zhao

IPC: B25J15/00 ,  H01L21/677 ,  H01L21/683 ,  H01L21/67 ,  H01L21/68 ,  B25J7/00 ,  B25J15/04

Abstract: Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.

公开(公告)号：US09828244B2

公开(公告)日：2017-11-28

申请号：US14502994

申请日：2014-09-30

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl ,  Jeffrey Birkmeyer

IPC: H01H59/00 ,  H01L41/113 ,  B81C99/00

CPC classification number: B81C99/002 ,  H01H59/0009 ,  H01L41/113

Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.

公开(公告)号：US20210213587A1

公开(公告)日：2021-07-15

申请号：US17071865

申请日：2020-10-15

Applicant: Apple Inc.

Inventor： Vaibhav D. Patel ,  John P. Staton ,  Jonathan M. Manzano ,  Stephen P. Bathurst

IPC: B24B41/06 ,  B24B41/00

Abstract: Multi-port polishing fixture assemblies, pick and place bond heads, split holders, and conditioning methods are described. In an embodiment, a multi-port polishing fixture assembly includes a fixture base, a plurality of split holders fastenable to a perimeter surface with a plurality of kinematic plurality of kinematic clamps. The pick and place bond heads may be secured inside the plurality of split holders to reduce edge-fast polishing during conditioning of the distal bond surfaces of the pick and place bond heads.