CAMERA MODULE DESIGN WITH LEAD FRAME AND PLASTIC MOULDING
    1.
    发明申请
    CAMERA MODULE DESIGN WITH LEAD FRAME AND PLASTIC MOULDING 审中-公开
    相机模块设计与引导框架和塑料模制

    公开(公告)号:US20170041513A1

    公开(公告)日:2017-02-09

    申请号:US14820485

    申请日:2015-08-06

    Applicant: Apple Inc.

    Abstract: A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmoulding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.

    Abstract translation: 相机模块包括图像传感器,柔性印刷电路,其具有固定到图像传感器的第一侧的第一侧,固定到图像传感器的第二侧的多个金属引线,以及用于将光引导到 图像传感器通过连接到引线和柔性印刷电路的包覆成型中的一个或多个连接到图像传感器。 图像传感器的第一侧是与图像传感器的第二侧相对的一侧。 引线提供图像传感器和柔性印刷电路中的引线之间的连接。

    Camera module design with lead frame and plastic moulding

    公开(公告)号:US10447900B2

    公开(公告)日:2019-10-15

    申请号:US14820485

    申请日:2015-08-06

    Applicant: Apple Inc.

    Abstract: A camera module includes an image sensor, a flexible printed circuit with a first side affixed to a first side of the image sensor, a plurality of metallic leads affixed to a second side of the image sensor, and a lens assembly for directing light to the image sensor articulated to the image sensor by one or more of an overmolding attached to the leads and the flexible printed circuit. The first side of the image sensor is a side opposite the second side of the image sensor. The leads provide connection between the image sensor and leads in the flexible printed circuit.

Patent Agency Ranking