公开(公告)号：US10356903B1

公开(公告)日：2019-07-16

申请号：US15939097

申请日：2018-03-28

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K1/18 ,  H05K3/46

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

公开(公告)号：US10966321B2

公开(公告)日：2021-03-30

申请号：US16894463

申请日：2020-06-05

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H01L25/11 ,  H05K3/46 ,  H01L23/00 ,  H05K1/18

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

公开(公告)号：US10709018B2

公开(公告)日：2020-07-07

申请号：US16426443

申请日：2019-05-30

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/00 ,  H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  H01L25/11

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

公开(公告)号：US20200375033A1

公开(公告)日：2020-11-26

申请号：US16894463

申请日：2020-06-05

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/14 ,  H05K3/00 ,  H05K3/28 ,  H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  H01L25/11

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.

公开(公告)号：US20190306979A1

公开(公告)日：2019-10-03

申请号：US16426443

申请日：2019-05-30

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar Pennathur ,  Mandar Painaik ,  Lan Hoang ,  Meng Chi Lee

IPC: H05K1/14 ,  H05K3/46 ,  H05K3/00 ,  H05K3/28 ,  H05K1/18

Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.