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公开(公告)号：US20170263569A1
公开(公告)日：2017-09-14
申请号：US15403046
申请日：2017-01-10
Applicant: Apple Inc.
Inventor： Phillip R. Sommer , Shankar Pennathur , Meng Chi Lee , Shakti S. Chauhan , Yanfeng Chen
IPC: H01L23/552 , H01L25/065 , H01L23/498 , H01L21/56 , H01L23/00 , H01L21/3205 , H01L21/285 , H01L21/268 , H01L25/00 , H01L23/31 , H01L21/288
CPC classification number: H01L23/552 , H01L21/268 , H01L21/2855 , H01L21/2885 , H01L21/32051 , H01L21/561 , H01L23/3121 , H01L23/49838 , H01L24/13 , H01L24/16 , H01L24/75 , H01L24/81 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L2224/0401 , H01L2224/131 , H01L2224/16227 , H01L2224/7565 , H01L2224/81801 , H01L2224/97 , H01L2225/06517 , H01L2225/06572 , H01L2924/01013 , H01L2924/01026 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0104 , H01L2924/01073 , H01L2924/0132 , H01L2924/0133 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15313 , H01L2924/1815 , H01L2924/3025 , H01L2224/81 , H01L2924/014 , H01L2924/00014
Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.
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公开(公告)号：US10709018B2
公开(公告)日：2020-07-07
申请号：US16426443
申请日：2019-05-30
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar Pennathur , Mandar Painaik , Lan Hoang , Meng Chi Lee
Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
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公开(公告)号：US20200375033A1
公开(公告)日：2020-11-26
申请号：US16894463
申请日：2020-06-05
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar Pennathur , Mandar Painaik , Lan Hoang , Meng Chi Lee
Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
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公开(公告)号：US20190306979A1
公开(公告)日：2019-10-03
申请号：US16426443
申请日：2019-05-30
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar Pennathur , Mandar Painaik , Lan Hoang , Meng Chi Lee
Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
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公开(公告)号：US10966321B2
公开(公告)日：2021-03-30
申请号：US16894463
申请日：2020-06-05
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar Pennathur , Mandar Painaik , Lan Hoang , Meng Chi Lee
Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
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Patent Agency Ranking
公开(公告)号：US20150359099A1
公开(公告)日：2015-12-10
申请号：US14296449
申请日：2014-06-04
Applicant: Apple Inc.
Inventor： Shankar Pennathur , Dennis R. Pyper , Amir Salehi
CPC classification number: H05K1/181 , H05K1/115 , H05K1/141 , H05K1/144 , H05K1/189 , H05K3/284 , H05K3/303 , H05K3/363 , H05K3/4015 , H05K2201/042 , H05K2201/10318 , H05K2201/10378 , H05K2203/1316 , Y10T29/49128
Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins to form interconnect paths between a module and other components.
Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在电子设备中的系统级封装模块和其它部件之间提供互连的插入器。 另一个可以提供多个导电引脚以在模块和其它部件之间形成互连路径。
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公开(公告)号：US10356903B1
公开(公告)日：2019-07-16
申请号：US15939097
申请日：2018-03-28
Applicant: Apple Inc.
Inventor： Yanfeng Chen , Shankar Pennathur , Mandar Painaik , Lan Hoang , Meng Chi Lee
Abstract: System-in-package structures and methods of assembly are described. In an embodiment, a system-in-package includes opposing circuit boards, each including mounted components overlapping the mounted components of the opposing circuit board. A gap between the opposing circuit boards may be filled with a molding material, that additionally encapsulates the overlapping mounted components. In some embodiments, the opposing circuit boards are stacked on one another using one or more interposers that may provide mechanical or electrical connection.
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公开(公告)号：US10147685B2
公开(公告)日：2018-12-04
申请号：US15403046
申请日：2017-01-10
Applicant: Apple Inc.
Inventor： Phillip R. Sommer , Shankar Pennathur , Meng Chi Lee , Shakti S. Chauhan , Yanfeng Chen
IPC: H01L23/552 , H01L23/31 , H01L25/065 , H01L23/498 , H01L21/288 , H01L21/3205 , H01L21/285 , H01L21/268 , H01L23/00 , H01L21/56
Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.
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公开(公告)号：US09839133B2
公开(公告)日：2017-12-05
申请号：US14730250
申请日：2015-06-04
Applicant: APPLE INC.
Inventor： Meng Chi Lee , Shankar Pennathur , Scott L. Gooch , Dennis R. Pyper , Amir Salehi
CPC classification number: H05K1/189 , H01L23/4012 , H01L25/0652 , H01L25/0655 , H05K1/141 , H05K1/144 , H05K1/181 , H05K3/284 , H05K3/361 , H05K3/4015 , H05K2201/10318 , H05K2201/10378 , H05K2203/1316 , Y10T29/49128
Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.
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公开(公告)号：US20160021756A1
公开(公告)日：2016-01-21
申请号：US14730250
申请日：2015-06-04
Applicant: APPLE INC.
Inventor： Meng Chi Lee , Shankar Pennathur , Scott L. Gooch , Dennis R. Pyper , Amir Salehi
CPC classification number: H05K1/189 , H01L23/4012 , H01L25/0652 , H01L25/0655 , H05K1/141 , H05K1/144 , H05K1/181 , H05K3/284 , H05K3/361 , H05K3/4015 , H05K2201/10318 , H05K2201/10378 , H05K2203/1316 , Y10T29/49128
Abstract: Readily modifiable and customizable, low-area overhead interconnect structures for forming connections between a system-in-a-package module and other components in an electronic device. One example may provide an interposer for providing an interconnection between a system-in-a-package module and other components in an electronic device. Another may provide a plurality of conductive pins or contacts to form interconnect paths between a module and other components.
Abstract translation: 易于修改和可定制的低面积架空互连结构，用于在系统级封装模块和电子设备中的其他组件之间形成连接。 一个示例可以提供用于在电子设备中的系统级封装模块和其它部件之间提供互连的插入器。 另一个可以提供多个导电引脚或触点以在模块和其它部件之间形成互连路径。
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