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公开(公告)号:US10747274B2
公开(公告)日:2020-08-18
申请号:US15253758
申请日:2016-08-31
Applicant: Apple Inc.
Inventor: Erik A. Uttermann , John Raff , Melody L. Kuna , Jason S. Keats , G. Kyle Lobisser , John R. Kamorowski , Oliver C. Ross , Guangtao Zhang , Santhana Krishnan Balaji , Jiang Ai , Robert Scritzky , Stephen R. McClure
Abstract: A portable electronic device, having a single piece housing to carry operational components having a front opening, an integral bottom and sidewalls that cooperate to form a cavity in cooperation with the front opening. The operational components can include a display to present visual content disposed within the front opening and having an outermost protective layer, a main logic board that extends along a central portion of the cavity having a size and shape that bisects the cavity into a first portion and a second portion each having substantially the same size and shape, a power storage system supported at the bottom wall and comprising a first power storage unit located in the first portion and second power storage unit located in the second portion, each being coupled to the main logic board, and self-contained audio components positioned at each corner of the single piece housing.
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公开(公告)号:US10021480B2
公开(公告)日:2018-07-10
申请号:US14495777
申请日:2014-09-24
Applicant: Apple Inc.
Inventor: G. Kyle Lobisser , Jason S. Keats , Ryan J. Mihelich , Pablo Seoane Vieites , Kevin M. Kenney , John Raff , Erik A. Uttermann , Melody L. Kuna , Oliver C. Ross
CPC classification number: H04R1/2888 , H04R1/2834 , H04R2201/029 , H04R2499/11
Abstract: An enclosure for an electronic device is enclosed. The enclosure includes rib structures configured to improve structural support to prevent damage and to dissipate vibration throughout the enclosure. The rib structure can receive a speaker module and a cap member. The rib structure and the speaker module can combine to form a three-dimensional volume allowing the speaker module in which the speaker module may project sound, thereby enhancing acoustic performance. Also, the cap member may be adhesively attached to the rib structure to provide additional structural support against vibration and abuse caused by load forces associated with a drop event.
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公开(公告)号:US20180226739A1
公开(公告)日:2018-08-09
申请号:US15948050
申请日:2018-04-09
Applicant: Apple Inc.
Inventor: Daniel C. Wagman , Oliver C. Ross , Eric S. Jol , Hani Esmaeili
CPC classification number: H01R13/40 , G06F1/1656 , H01R12/77 , H01R13/22 , H01R13/521
Abstract: Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.
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公开(公告)号:US20170069994A1
公开(公告)日:2017-03-09
申请号:US15138216
申请日:2016-04-26
Applicant: Apple Inc.
Inventor: Daniel C. Wagman , Oliver C. Ross , Eric S. Jol , Hiva Esmaeili
CPC classification number: H01R13/40 , G06F1/1656 , H01R12/77 , H01R13/22 , H01R13/521
Abstract: Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.
Abstract translation: 容易制造的触点结构,其中接触结构中的触点在电子设备中消耗最少量的表面积,深度和体积。
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公开(公告)号:US20190109398A1
公开(公告)日:2019-04-11
申请号:US16214121
申请日:2018-12-09
Applicant: Apple Inc.
Inventor: Daniel C. Wagman , Oliver C. Ross , Eric S. Jol , Hani Esmaeili
CPC classification number: H01R13/40 , G06F1/1656 , H01R12/77 , H01R13/22 , H01R13/521
Abstract: Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.
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公开(公告)号:US10153577B2
公开(公告)日:2018-12-11
申请号:US15948050
申请日:2018-04-09
Applicant: Apple Inc.
Inventor: Daniel C. Wagman , Oliver C. Ross , Eric S. Jol , Hani Esmaeili
Abstract: Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.
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公开(公告)号:US10418741B2
公开(公告)日:2019-09-17
申请号:US16214121
申请日:2018-12-09
Applicant: Apple Inc.
Inventor: Daniel C. Wagman , Oliver C. Ross , Eric S. Jol , Hani Esmaeili
Abstract: Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.
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公开(公告)号:US09948018B2
公开(公告)日:2018-04-17
申请号:US15138216
申请日:2016-04-26
Applicant: Apple Inc.
Inventor: Daniel C. Wagman , Oliver C. Ross , Eric S. Jol , Hani Esmaeili
CPC classification number: H01R13/40 , G06F1/1656 , H01R12/77 , H01R13/22 , H01R13/521
Abstract: Contact structures that are readily manufactured, where contacts in the contact structures consume a minimal amount of surface area, depth, and volume in an electronic device.
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公开(公告)号:US09905964B2
公开(公告)日:2018-02-27
申请号:US15256156
申请日:2016-09-02
Applicant: Apple Inc.
Inventor: Brett W. Degner , David H. Narajowski , Oliver C. Ross , Hao Zhu , Erik A. Uttermann , Stephen R. McClure , Melody L. Kuna
IPC: H01R13/62 , H01R13/631
CPC classification number: H01R13/6205 , H01R13/6315
Abstract: An accessory to device coupling system can include a first magnet array adapted for assembly with respect to a surface of an electronic device and a second magnet array adapted for assembly with respect to a surface of an accessory device, the accessory device configured to interact electrically with the electronic device. The first magnet array can include a first plurality of magnets arranged in a first pattern of alternating polarities, and the second magnet array can include a second plurality of magnets arranged in a second pattern of alternating polarities that corresponds to the first pattern of alternating polarities. The corresponding alternating polarity patterns can cause the second magnet array to couple to the first magnet array with a normalized attraction force only at an intended orientation and alignment, and with less than half of the normalized attraction force at any other orientation and alignment.
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公开(公告)号:US20160088379A1
公开(公告)日:2016-03-24
申请号:US14495777
申请日:2014-09-24
Applicant: Apple Inc.
Inventor: G. Kyle Lobisser , Jason S. Keats , Ryan J. Mihelich , Pablo Seoane Vieites , Kevin M. Kenney , John Raff , Erik A. Uttermann , Melody L. Kuna , Oliver C. Ross
CPC classification number: H04R1/2888 , H04R1/2834 , H04R2201/029 , H04R2499/11
Abstract: An enclosure for an electronic device is enclosed. The enclosure includes rib structures configured to improve structural support to prevent damage and to dissipate vibration throughout the enclosure. The rib structure can receive a speaker module and a cap member. The rib structure and the speaker module can combine to form a three-dimensional volume allowing the speaker module in which the speaker module may project sound, thereby enhancing acoustic performance. Also, the cap member may be adhesively attached to the rib structure to provide additional structural support against vibration and abuse caused by load forces associated with a drop event.
Abstract translation: 封闭电子设备外壳。 外壳包括构造成改善结构支撑以防止损坏并消散整个外壳的振动的肋结构。 肋结构可以接收扬声器模块和盖构件。 肋结构和扬声器模块可以组合形成三维体积,从而允许扬声器模块可以投影声音的扬声器模块,从而增强声学性能。 此外,盖构件可以粘合地附接到肋结构,以提供抵抗由与落下事件相关联的负载力引起的振动和滥用的附加结构支撑。
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