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1.发明申请THERMAL MODULE ACCOUNTING FOR INCREASED BOARD/DIE SIZE IN A PORTABLE COMPUTER 有权在便携式计算机中增加板/尺寸的热模块会计公开(公告)号：US20150262907A1
公开(公告)日：2015-09-17
申请号：US14214315
申请日：2014-03-14
Applicant: Apple Inc.
Inventor： Brett W. Degner , Gavin J. Reid , Brandon S. Smith , Raymond S. Shan
CPC classification number: H01L23/4006 , F28D15/0233 , F28D15/0275 , F28D15/04 , H01L23/427 , H01L2023/4081 , H01L2924/0002 , H05K1/0203 , H05K1/181 , H05K7/20336 , H01L2924/00
Abstract: This application relates to a low profile, small footprint cooling stack that does not extend substantially beyond a footprint of an integrated circuit to which it is affixed. The cooling stack utilizes a number of beam springs that supply a seating force to the integrated circuit by way of a metal slug. In some embodiments, a bottom surface of the metal slug can be contoured in accordance with a top surface of the integrated circuit and/or socket. In other embodiments a gap between peripheral portion of a bottom surface of the metal slug and an associated printed circuit board can be filled by a layer of foam to reduce auditory signals generated by the integrated circuit.
Abstract translation: 本申请涉及一种低外形，占地面积小的冷却堆，其基本上不超过其所固定的集成电路的占地面积。 冷却堆栈利用多个梁弹簧，其通过金属块向集成电路提供就座力。 在一些实施例中，金属块的底表面可以根据集成电路和/或插座的顶表面进行成形。 在其他实施例中，金属块的底表面的周边部分与相关联的印刷电路板之间的间隙可由一层泡沫填充以减少集成电路产生的听觉信号。
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2.发明授权Thermal module accounting for increased board/die size in a portable computer 有权散热模块考虑了便携式计算机中板/芯片尺寸的增加公开(公告)号：US09379037B2
公开(公告)日：2016-06-28
申请号：US14214315
申请日：2014-03-14
Applicant: Apple Inc.
Inventor： Brett W. Degner , Gavin J. Reid , Brandon S. Smith , Raymond S. Shan
CPC classification number: H01L23/4006 , F28D15/0233 , F28D15/0275 , F28D15/04 , H01L23/427 , H01L2023/4081 , H01L2924/0002 , H05K1/0203 , H05K1/181 , H05K7/20336 , H01L2924/00
Abstract: This application relates to a low profile, small footprint cooling stack that does not extend substantially beyond a footprint of an integrated circuit to which it is affixed. The cooling stack utilizes a number of beam springs that supply a seating force to the integrated circuit by way of a metal slug. In some embodiments, a bottom surface of the metal slug can be contoured in accordance with a top surface of the integrated circuit and/or socket. In other embodiments a gap between peripheral portion of a bottom surface of the metal slug and an associated printed circuit board can be filled by a layer of foam to reduce auditory signals generated by the integrated circuit.
Abstract translation: 本申请涉及一种低外形，占地面积小的冷却堆，其基本上不超过其所固定的集成电路的占地面积。 冷却堆栈利用多个梁弹簧，其通过金属块向集成电路提供就座力。 在一些实施例中，金属块的底表面可以根据集成电路和/或插座的顶表面进行成形。 在其他实施例中，金属块的底表面的周边部分与相关联的印刷电路板之间的间隙可由一层泡沫填充以减少集成电路产生的听觉信号。
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