公开(公告)号：US12301744B2

公开(公告)日：2025-05-13

申请号：US17903963

申请日：2022-09-06

Applicant: Apple Inc.

Inventor： David A. Hurrell ,  Gregory N. Stephens ,  Isabel Yang ,  John J. Baker ,  Sherry Lee ,  Matthew D. Hill ,  Obinna Onyemepu ,  Douglas G. Fournier ,  Benjamin J. Pope ,  Michael W. Firka ,  Griffin L. Schmitt ,  Arun R. Varma ,  Robert Hrabchak

IPC: H05K7/20 ,  G06F1/20 ,  G06F3/01 ,  G06F3/0488 ,  G09G3/18 ,  H02K33/02 ,  H04M1/02 ,  H04N23/51 ,  H04N23/55 ,  H04N23/90

Abstract: A mobile phone may include an enclosure defining an internal volume, the enclosure including a front cover formed from a transparent material and defining a front exterior surface, a rear cover formed from a glass material and defining a rear exterior surface, and a housing component defining a side exterior surface. The mobile phone may include a circuit board assembly within the internal volume. The circuit board assembly may include a circuit board, a circuit component coupled to an exterior surface of the circuit board, and a cowling coupled to the circuit board and covering the circuit component, the cowling having a thickness less than about 0.5 mm and including a base structure formed from an aluminum alloy having a thickness less than about 0.4 mm and a thermally conductive structure positioned over the base structure and configured to dissipate heat.

公开(公告)号：US20240080986A1

公开(公告)日：2024-03-07

申请号：US18450701

申请日：2023-08-16

Applicant: Apple Inc.

Inventor： David A. Karol ,  Yaodong Wang ,  Obinna O. Onyemepu ,  Zhong J. Ma ,  Harshavardhan Reddy Abbeydoddi Bolla ,  Robert Hrabchak

IPC: H05K1/18 ,  H05K3/00

CPC classification number: H05K1/181 ,  H05K3/0011 ,  H05K2201/10015 ,  H05K2201/10151 ,  H05K2201/10431

Abstract: The present disclosure relates to a contaminant shield system. The contaminant shield system may surround an electronic device, such as a local oscillator (e.g., a crystal oscillator), to prevent contamination of the electronic device via coupling material (e.g., under-fill material) creep or wicking. The contaminant shield system includes multiple walls and at least one wall includes a pick-and-place feature that facilitates positioning of the contaminant shield system during assembly of a circuit board that includes the contaminant shield system.

公开(公告)号：US20230221782A1

公开(公告)日：2023-07-13

申请号：US17903963

申请日：2022-09-06

Applicant: Apple Inc.

Inventor： David A. Hurrell ,  Gregory N. Stephens ,  Isabel Yang ,  John J. Baker ,  Sherry Lee ,  Matthew D. Hill ,  Obinna Onyemepu ,  Douglas G. Fournier ,  Benjamin J. Pope ,  Michael W. Firka ,  Griffin L. Schmitt ,  Arun R. Varma ,  Robert Hrabchak

IPC: G06F1/20 ,  H05K7/20 ,  H04M1/02

CPC classification number: G06F1/203 ,  H05K7/20481 ,  H05K7/205 ,  H04M1/0202

Abstract: A mobile phone may include an enclosure defining an internal volume, the enclosure including a front cover formed from a transparent material and defining a front exterior surface, a rear cover formed from a glass material and defining a rear exterior surface, and a housing component defining a side exterior surface. The mobile phone may include a circuit board assembly within the internal volume. The circuit board assembly may include a circuit board, a circuit component coupled to an exterior surface of the circuit board, and a cowling coupled to the circuit board and covering the circuit component, the cowling having a thickness less than about 0.5 mm and including a base structure formed from an aluminum alloy having a thickness less than about 0.4 mm and a thermally conductive structure positioned over the base structure and configured to dissipate heat.