公开(公告)号：US10587070B2

公开(公告)日：2020-03-10

申请号：US16174219

申请日：2018-10-29

Applicant: APPLE INC.

Inventor： Ross C. Heyman ,  Cesar Lozano Villarreal ,  Johnathan D. Simeroth

IPC: H01R13/506 ,  H01R43/20 ,  H01R13/66

Abstract: An enclosure for an electronic device includes a housing having a wall defining a cavity that is configured to receive an electronic assembly therein. The wall includes a distal end having a tongue. A cap is sized to attach to the housing with a corresponding groove that is formed in a perimeter of the cap. A double shear weld joint is formed between the tongue and the groove such that flash from the weld is contained within the enclosure and is not visible on the exterior surface of the enclosure.

公开(公告)号：US10283898B2

公开(公告)日：2019-05-07

申请号：US15974185

申请日：2018-05-08

Applicant: Apple Inc.

Inventor： Ross C. Heyman ,  Alfredo Castillo ,  Arun R. Varma

IPC: H05K7/02 ,  H05K7/04 ,  H01R13/504 ,  H05K5/02 ,  H01R31/06 ,  B29D99/00 ,  H02M7/00

Abstract: An enclosure for an AC to DC adapter has a continuous and apparently monolithic exterior appearance. The enclosure includes a housing and a cap that are joined together by one or more weld joints. The weld joints create flash on the exterior surface of the enclosure and the flash is removed by forming a chamfer along the weld joint such that it removes a portion of the housing and the cap.

公开(公告)号：US20190372265A1

公开(公告)日：2019-12-05

申请号：US16174219

申请日：2018-10-29

Applicant: APPLE INC.

Inventor： Ross C. Heyman ,  Cesar Lozano Villarreal ,  Johnathan D. Simeroth

IPC: H01R13/506 ,  H01R13/66 ,  H01R43/20

Abstract: An enclosure for an electronic device includes a housing having a wall defining a cavity that is configured to receive an electronic assembly therein. The wall includes a distal end having a tongue. A cap is sized to attach to the housing with a corresponding groove that is formed in a perimeter of the cap. A double shear weld joint is formed between the tongue and the groove such that flash from the weld is contained within the enclosure and is not visible on the exterior surface of the enclosure.

公开(公告)号：US20190081431A1

公开(公告)日：2019-03-14

申请号：US15974185

申请日：2018-05-08

Applicant: Apple Inc.

Inventor： Ross C. Heyman ,  Alfredo Castillo ,  Arun R. Varma

IPC: H01R13/504 ,  H05K5/02 ,  H01R31/06

Abstract: An enclosure for an AC to DC adapter has a continuous and apparently monolithic exterior appearance. The enclosure includes a housing and a cap that are joined together by one or more weld joints. The weld joints create flash on the exterior surface of the enclosure and the flash is removed by forming a chamfer along the weld joint such that it removes a portion of the housing and the cap.