公开(公告)号：US20220334431A1

公开(公告)日：2022-10-20

申请号：US17409458

申请日：2021-08-23

Applicant: Apple Inc.

Inventor： Daming Xu ,  Wei Lv ,  Pee Khiam So ,  Wenyong Zhu ,  Rong Liu ,  Victor H. Yin ,  Mookyung Son ,  Jun Qi ,  Yufeng Yan ,  Shaofeng Liu ,  Thomas O. Henry ,  Suraj P. Gorkhali

IPC: G02F1/13357

Abstract: A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes on a printed circuit board. The backlight unit may include first, second, and third light spreading layers formed over the array of light-emitting diodes. A color conversion layer may be formed over the first, second, and third light spreading layers. First and second brightness enhancement films may be formed over the color conversion layer.

公开(公告)号：US11650484B1

公开(公告)日：2023-05-16

申请号：US16943835

申请日：2020-07-30

Applicant: Apple Inc.

Inventor： Rong Liu ,  Benjamin M. Oztalay ,  Chenhua You ,  Corey S. Provencher ,  Florence W. Ow ,  Jeremy L. Britt ,  Joshua A. Spechler ,  Jun Qi ,  Ling Han ,  Shaofeng Liu ,  Sherry Cao ,  Tavys Q. Ashcroft ,  Victor H. Yin ,  Wenyong Zhu ,  Ziruo Hong ,  Janos C. Keresztes ,  Hung Sheng Lin

IPC: G03B17/18 ,  F21V3/06 ,  H04N5/232 ,  F21Y113/17 ,  F21Y115/10 ,  F21Y115/30 ,  F21W111/00

CPC classification number: G03B17/18 ,  F21V3/0625 ,  H04N5/23229 ,  F21W2111/00 ,  F21Y2113/17 ,  F21Y2115/10 ,  F21Y2115/30

Abstract: An electronic device may have a camera. The camera may capture still and moving images. A camera status indicator may be included in the electronic device. The camera status indicator may emit light to indicate when the camera is in use capturing video or other images. The camera status indicator may have multiple light-emitting devices such as light-emitting diodes or lasers. The light-emitting devices may have different colors. Clear encapsulant may cover the light-emitting devices. A white polymer wall or other light recycling structure may run along an outer peripheral edge of the encapsulant. A light diffusing coating layer may coat an outer surface of the clear encapsulant. Light reflections from the status indicator may be reduced in captured images.

公开(公告)号：US11526051B2

公开(公告)日：2022-12-13

申请号：US17409458

申请日：2021-08-23

Applicant: Apple Inc.

Inventor： Daming Xu ,  Wei Lv ,  Pee Khiam So ,  Wenyong Zhu ,  Rong Liu ,  Victor H. Yin ,  Mookyung Son ,  Jun Qi ,  Yufeng Yan ,  Shaofeng Liu ,  Thomas O. Henry ,  Suraj P. Gorkhali

IPC: G02F1/13357

Abstract: A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes on a printed circuit board. The backlight unit may include first, second, and third light spreading layers formed over the array of light-emitting diodes. A color conversion layer may be formed over the first, second, and third light spreading layers. First and second brightness enhancement films may be formed over the color conversion layer.

公开(公告)号：US20220005798A1

公开(公告)日：2022-01-06

申请号：US17475831

申请日：2021-09-15

Applicant: Apple Inc.

Inventor： Jun Qi ,  Rong Liu ,  Saijin Liu ,  Shaofeng Liu ,  Tongbi T. Jiang ,  Victor H. Yin ,  Xia Li ,  Xiang Fang ,  Ziruo Hong

IPC: H01L25/16 ,  G02B27/01 ,  H01L23/00 ,  H01L33/62

Abstract: An electronic device may include a display having a monolithic array of light-emitting diodes mounted to a surface of a substrate layer. The diodes may include contact pads. Driver circuitry may independently drive each of the diodes in the array using drive signals. The driver circuitry may be formed on a driver integrated circuit. Bond pads may be formed on a surface of the integrated circuit. Copper pillars may be grown on the bond pads. In another suitable arrangement, the driver circuitry may be formed on a driver printed circuit board coupled to an interposer by a flexible printed circuit. The interposer may include bond pads and copper pillars grown on the bond pads. The contact pads on each of the diodes may be simultaneously bonded to the copper pillars. A surface of the substrate layer may be patterned to form light redirecting elements if desired.