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公开(公告)号:US12050436B2
公开(公告)日:2024-07-30
申请号:US17406826
申请日:2021-08-19
Applicant: Apple Inc.
Inventor: Jozef M. Matlak , Brian S. Tryon , Lijie Bao , Maruwada Sukanya Sharma , Shiva K. Mandepudi , Sonja R. Postak
CPC classification number: G04G17/08 , C23C14/0015 , C23C14/025 , C23C14/0641 , C23C14/0664 , C23C14/35 , C23C28/34
Abstract: An electronic device may include conductive structures such as conductive housing structures. A high-brightness, visible-light-reflecting coating may be formed on the conductive structures. The coating may have adhesion and transition layers and an uppermost coloring layer on the adhesion and transition layers. At least the uppermost coloring layer may be deposited using a high impulse magnetron sputtering (HiPIMS) process. The uppermost coloring layer may include a TiCrN film, a TiCrCN film, a TiCN film, or a metal nitride film that contains Ti, Zr, Hf, or Cr. The coating may exhibit a high-brightness gold color.
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公开(公告)号:US20240337986A1
公开(公告)日:2024-10-10
申请号:US18747167
申请日:2024-06-18
Applicant: Apple Inc.
Inventor: Jozef M. Matlak , Brian S. Tryon , Lijie Bao , Maruwada Sukanya Sharma , Shiva K. Mandepudi , Sonja R. Postak
CPC classification number: G04G17/08 , C23C14/0015 , C23C14/025 , C23C14/0641 , C23C14/0664 , C23C14/35 , C23C28/34
Abstract: An electronic device may include conductive structures such as conductive housing structures. A high-brightness, visible-light-reflecting coating may be formed on the conductive structures. The coating may have adhesion and transition layers and an uppermost coloring layer on the adhesion and transition layers. At least the uppermost coloring layer may be deposited using a high impulse magnetron sputtering (HiPIMS) process. The uppermost coloring layer may include a TiCrN film, a TiCrCN film, a TiCN film, or a metal nitride film that contains Ti, Zr, Hf, or Cr. The coating may exhibit a high-brightness gold color.
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公开(公告)号:US20220066397A1
公开(公告)日:2022-03-03
申请号:US17406826
申请日:2021-08-19
Applicant: Apple Inc.
Inventor: Jozef M. Matlak , Brian S. Tryon , Lijie Bao , Maruwada Sukanya Sharma , Shiva K. Mandepudi , Sonja R. Postak
Abstract: An electronic device may include conductive structures such as conductive housing structures. A high-brightness, visible-light-reflecting coating may be formed on the conductive structures. The coating may have adhesion and transition layers and an uppermost coloring layer on the adhesion and transition layers. At least the uppermost coloring layer may be deposited using a high impulse magnetron sputtering (HiPIMS) process. The uppermost coloring layer may include a TiCrN film, a TiCrCN film, a TiCN film, or a metal nitride film that contains Ti, Zr, Hf, or Cr. The coating may exhibit a high-brightness gold color.
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