公开(公告)号：US10455707B1

公开(公告)日：2019-10-22

申请号：US16100456

申请日：2018-08-10

Applicant: Apple Inc.

Inventor： Kenneth Leland Kiplinger ,  Mark J. Beesley ,  Shawn Xavier Arnold ,  Shyam Harindralal Ratnayake ,  Meng Chi Lee

IPC: H05K3/34 ,  H05K3/46 ,  H05K1/11 ,  H05K1/18 ,  H01L23/498

Abstract: Described herein are printed circuit boards (PCBs), PCB assemblies, and methods of manufacture thereof, which allow free placement of electrical components. The PCBs may have electrical pads that may couple to components through via-based connections and without the use of solder. The electrical components may be physically attached to the PCBs through tight fitting, lamination, and/or the use of adhesives. The distance between adjacent vias may be reduced, as accidental short-circuit risks due to solder bridging and similar effects are mitigated when the soldering process is bypassed. The PCB design and component placement may be flexible as to allow the use of electrical components with custom shape and/or customized terminal placement.