公开(公告)号：US10022859B2

公开(公告)日：2018-07-17

申请号：US15054977

申请日：2016-02-26

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl ,  Paul Argus Parks ,  Stephen Paul Bathurst

IPC: B25J9/10 ,  H01L21/67 ,  B25J15/00 ,  B25J9/00 ,  B25J17/02 ,  H01L23/00 ,  B25J7/00 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.