公开(公告)号：US09711387B2

公开(公告)日：2017-07-18

申请号：US15212962

申请日：2016-07-18

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L29/76 ,  H01L21/683 ,  H01L29/06 ,  H01L21/266 ,  B81C99/00 ,  B32B38/18 ,  H01L23/00 ,  H02N13/00 ,  H01L21/308 ,  H01L21/762 ,  H01L29/40 ,  H01L29/66 ,  H01L29/78 ,  H01L29/872

CPC classification number: H01L21/6833 ,  B32B38/18 ,  B81C99/002 ,  H01L21/266 ,  H01L21/3083 ,  H01L21/76264 ,  H01L24/75 ,  H01L29/06 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/66143 ,  H01L29/66348 ,  H01L29/7806 ,  H01L29/7813 ,  H01L29/872 ,  H01L29/8725 ,  H01L2224/7598 ,  H01L2924/1461 ,  H02N13/00 ,  Y10T156/17

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

公开(公告)号：US11948815B2

公开(公告)日：2024-04-02

申请号：US17345253

申请日：2021-06-11

Applicant: Apple Inc.

Inventor： Antoine Manens ,  Dariusz Golda ,  Hyeun-Su Kim

IPC: H01L21/67 ,  B65G47/90 ,  H01L25/075 ,  H01L33/62 ,  B41F16/00

CPC classification number: H01L21/67144 ,  B65G47/90 ,  H01L25/0753 ,  H01L33/62 ,  B41F16/00 ,  H01L2933/0066

Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.

公开(公告)号：US10804127B2

公开(公告)日：2020-10-13

申请号：US15562738

申请日：2016-03-14

Applicant: Apple Inc.

Inventor： Stephen P. Bathurst ,  John A. Higginson ,  Dariusz Golda ,  Hyeun-Su Kim

IPC: H01L21/67 ,  H01L21/677 ,  B08B6/00 ,  H01L21/683

Abstract: An electrostatic cleaning device, mass transfer tool, and method of operation are disclosed. In an embodiment an electrostatic cleaning device includes a cleaning electrode area including a first electrode pattern, a first trace line connected to the first electrode pattern, and a dielectric layer covering the cleaning electrode and the first trace line. In an embodiment, a mass transfer tool includes a translatable transfer head assembly that is translatable over a carrier substrate stage, a receiving substrate stage, and an electrostatic cleaning stage.

公开(公告)号：US20170271192A1

公开(公告)日：2017-09-21

申请号：US15616676

申请日：2017-06-07

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  Andreas Bibl

IPC: H01L21/683 ,  B32B38/18 ,  B81C99/00 ,  H01L21/266 ,  H01L21/308 ,  H01L21/762 ,  H01L23/00 ,  H01L29/06 ,  H02N13/00 ,  H01L29/40 ,  H01L29/66 ,  H01L29/78 ,  H01L29/872

CPC classification number: H01L21/6833 ,  B32B38/18 ,  B81C99/002 ,  H01L21/266 ,  H01L21/3083 ,  H01L21/76264 ,  H01L24/75 ,  H01L29/06 ,  H01L29/0619 ,  H01L29/0692 ,  H01L29/0696 ,  H01L29/407 ,  H01L29/66143 ,  H01L29/66348 ,  H01L29/7806 ,  H01L29/7813 ,  H01L29/872 ,  H01L29/8725 ,  H01L2224/7598 ,  H01L2924/1461 ,  H02N13/00 ,  Y10T156/17

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

公开(公告)号：US20160293566A1

公开(公告)日：2016-10-06

申请号：US15182272

申请日：2016-06-14

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl

IPC: H01L23/00 ,  H01L25/16 ,  H01L33/00

CPC classification number: H01L24/75 ,  H01L24/97 ,  H01L25/167 ,  H01L33/00 ,  H01L2224/75725 ,  H01L2224/75843 ,  H01L2224/7598 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/351 ,  Y10T279/23 ,  H01L2924/00

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.

Abstract translation: 公开了用于从载体衬底传送微器件的系统和方法。 在一个实施例中，微拾取阵列安装件包括枢轴平台，以允许微拾取阵列自动对准载体衬底。 可以检测枢轴平台的偏转以控制微拾取阵列的进一步移动。

公开(公告)号：US12009347B1

公开(公告)日：2024-06-11

申请号：US17345272

申请日：2021-06-11

Applicant: Apple Inc.

Inventor： Andreas Bibl ,  Dariusz Golda ,  Chae Hyuck Ahn ,  Clayton K Chan ,  Hyeun-Su Kim

IPC: H01L25/075 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L33/486 ,  H01L2933/0066

Abstract: Donor substrate micro device stabilization structures and display structures are described. In an embodiment, a patterned electrically conductive layer is used to stabilize an array of micro devices on donor substrate with a plurality of tethers, which can be broken during a transfer sequence to transfer the array of micro devices from the donor substrate.

公开(公告)号：US10276419B1

公开(公告)日：2019-04-30

申请号：US15183608

申请日：2016-06-15

Applicant: Apple Inc.

Inventor： Hyeun-Su Kim ,  Dariusz Golda ,  John A. Higginson

IPC: H01L21/683 ,  B81C99/00 ,  H02N13/00 ,  B25J15/00

Abstract: A compliant electrostatic transfer head and array are described. In an embodiment a compliant electrostatic transfer head includes a base substrate, and a plurality of interdigitated spring electrodes that are deflectable together into a cavity toward the base substrate. Each spring electrode includes mesa structure, and the mesa structures of the plurality of interdigitated spring electrodes are aligned.

公开(公告)号：US10022859B2

公开(公告)日：2018-07-17

申请号：US15054977

申请日：2016-02-26

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  John A. Higginson ,  Andreas Bibl ,  Paul Argus Parks ,  Stephen Paul Bathurst

IPC: B25J9/10 ,  H01L21/67 ,  B25J15/00 ,  B25J9/00 ,  B25J17/02 ,  H01L23/00 ,  B25J7/00 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683

Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.

公开(公告)号：US09828244B2

公开(公告)日：2017-11-28

申请号：US14502994

申请日：2014-09-30

Applicant: Apple Inc.

Inventor： Dariusz Golda ,  Stephen P. Bathurst ,  John A. Higginson ,  Andreas Bibl ,  Jeffrey Birkmeyer

IPC: H01H59/00 ,  H01L41/113 ,  B81C99/00

CPC classification number: B81C99/002 ,  H01H59/0009 ,  H01L41/113

Abstract: A compliant electrostatic transfer head and method of forming a compliant electrostatic transfer head are described. In an embodiment, a compliant electrostatic transfer head includes a base substrate, a cavity template layer on the base substrate, a first confinement layer between the base substrate and the cavity template layer, and a patterned device layer on the cavity template layer. The patterned device layer includes an electrode that is deflectable toward a cavity in the cavity template layer. In an embodiment, a second confinement layer is between the cavity template layer and the patterned device layer.

公开(公告)号：US20220013380A1

公开(公告)日：2022-01-13

申请号：US17345258

申请日：2021-06-11

Applicant: Apple Inc.

Inventor： Hyeun-Su Kim ,  Dariusz Golda ,  Chae Hyuck Ahn ,  Kevin T. Huang ,  Eric B. Newton

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B65G47/90

Abstract: Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.