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公开(公告)号：US12015200B2
公开(公告)日：2024-06-18
申请号：US17468525
申请日：2021-09-07
申请人： Apple Inc.
发明人： Yue Chen , Andrew A. Efanov , Avee Arvind , Larbi Azzoug , Thuy Nguyen , William J. Noellert
CPC分类号： H01Q1/421 , H01Q1/273 , H01Q1/422 , H01Q9/0407 , H04B5/70
摘要： A wireless communication system may include an electronic device having an antenna element. The antenna element may convey radio-frequency signals greater than 10 GHz across a dielectric housing wall. A dielectric matching structure may be interposed between the antenna element and the dielectric housing wall. The wireless communication system may include external equipment having an antenna element communicatively coupled to the electronic device antenna element to convey firmware testing, debugging, restore, and/or other data via a near-field wireless communication link. The external equipment may be configured to receive the electronic device at an opening. A dielectric matching structure may be provided at the external equipment between the dielectric housing wall and the external equipment antenna element. The interior surface of the dielectric housing wall may have planar, convex, or concave portions.
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公开(公告)号：US20230072031A1
公开(公告)日：2023-03-09
申请号：US17468525
申请日：2021-09-07
申请人： Apple Inc.
发明人： Yue Chen , Andrew A. Efanov , Avee Arvind , Larbi Azzoug , Thuy Nguyen , William J. Noellert
摘要： A wireless communication system may include an electronic device having an antenna element. The antenna element may convey radio-frequency signals greater than 10 GHz across a dielectric housing wall. A dielectric matching structure may be interposed between the antenna element and the dielectric housing wall. The wireless communication system may include external equipment having an antenna element communicatively coupled to the electronic device antenna element to convey firmware testing, debugging, restore, and/or other data via a near-field wireless communication link. The external equipment may be configured to receive the electronic device at an opening. A dielectric matching structure may be provided at the external equipment between the dielectric housing wall and the external equipment antenna element. The interior surface of the dielectric housing wall may have planar, convex, or concave portions.
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公开(公告)号：US20240097340A1
公开(公告)日：2024-03-21
申请号：US18463262
申请日：2023-09-07
申请人： Apple Inc.
发明人： Thuy Nguyen , Behzad Biglarbegian
CPC分类号： H01Q9/0485 , H01Q1/241 , H01Q1/422
摘要： An electronic device may include baseband circuitry coupled to antennas over a communication path that includes signal paths on a first substrate, a second substrate, and a third substrate. The antennas may be disposed on the third substrate. A wireless connector may couple the paths on the third substrate to the paths on the second substrate. The wireless connector may include a first transceiver and first antenna on the third substrate and a second transceiver and second antenna on the second substrate. The wireless connector may include one or more dielectric layers disposed between the first antenna and the second antenna. The layers may form a smooth impedance transition between the first antenna and the second antenna. The layers may include one or two angled layers that redirect wireless signals between the first and second antennas to allow the first and second substrates to be offset within the device.
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