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1.
公开(公告)号:US10756622B2
公开(公告)日:2020-08-25
申请号:US16231904
申请日:2018-12-24
申请人: Apple Inc.
发明人: Sanjay Dabral , David A. Secker , Jun Zhai , Ralf M. Schmitt , Vidhya Ramachandran , Wenjie Mao
IPC分类号: H02M3/07 , G05F3/10 , H01L29/66 , H01L23/00 , H01L23/522
摘要: Power management systems are described. In an embodiment, a power management system includes a voltage source, a circuit load located within a chip, and a switched capacitor voltage regulator (SCVR) coupled to voltage source and the circuit load to receive an input voltage from the voltage source and supply an output voltage to the circuit load. The SCVR may include circuitry located within the chip and a discrete integrated passive device (IPD) connected to the chip.
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2.
公开(公告)号:US11101732B2
公开(公告)日:2021-08-24
申请号:US16943139
申请日:2020-07-30
申请人: Apple Inc.
发明人: Sanjay Dabral , David A. Secker , Jun Zhai , Ralf M. Schmitt , Vidhya Ramachandran , Wenjie Mao
IPC分类号: H02M3/07 , G05F3/10 , H01L29/66 , H01L23/00 , H01L23/522
摘要: Power management systems are described. In an embodiment, a power management system includes a voltage source, a circuit load located within a chip, and a switched capacitor voltage regulator (SCVR) coupled to voltage source and the circuit load to receive an input voltage from the voltage source and supply an output voltage to the circuit load. The SCVR may include circuitry located within the chip and a discrete integrated passive device (IPD) connected to the chip.
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3.
公开(公告)号:US11699949B2
公开(公告)日:2023-07-11
申请号:US17383983
申请日:2021-07-23
申请人: Apple Inc.
发明人: Sanjay Dabral , David A. Secker , Jun Zhai , Ralf M. Schmitt , Vidhya Ramachandran , Wenjie Mao
IPC分类号: H02M3/07 , G05F3/10 , H01L29/66 , H01L23/00 , H01L23/522
CPC分类号: H02M3/07 , G05F3/10 , H01L23/5223 , H01L23/5227 , H01L24/17 , H01L29/66181 , H01L2224/02379
摘要: Power management systems are described. In an embodiment, a power management system includes a voltage source, a circuit load located within a chip, and a switched capacitor voltage regulator (SCVR) coupled to voltage source and the circuit load to receive an input voltage from the voltage source and supply an output voltage to the circuit load. The SCVR may include circuitry located within the chip and a discrete integrated passive device (IPD) connected to the chip.
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4.
公开(公告)号:US20230299668A1
公开(公告)日:2023-09-21
申请号:US18323304
申请日:2023-05-24
申请人: Apple Inc.
发明人: Sanjay Dabral , David A. Secker , Jun Zhai , Ralf M. Schmitt , Vidhya Ramachandran , Wenjie Mao
IPC分类号: H02M3/07 , G05F3/10 , H01L29/66 , H01L23/00 , H01L23/522
CPC分类号: H02M3/07 , G05F3/10 , H01L23/5223 , H01L23/5227 , H01L24/17 , H01L29/66181 , H01L2224/02379
摘要: Power management systems are described. In an embodiment, a power management system includes a voltage source, a circuit load located within a chip, and a switched capacitor voltage regulator (SCVR) coupled to voltage source and the circuit load to receive an input voltage from the voltage source and supply an output voltage to the circuit load. The SCVR may include circuitry located within the chip and a discrete integrated passive device (IPD) connected to the chip.
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5.
公开(公告)号:US20220014095A1
公开(公告)日:2022-01-13
申请号:US17383983
申请日:2021-07-23
申请人: Apple Inc.
发明人: Sanjay Dabral , David A. Secker , Jun Zhai , Ralf M. Schmitt , Vidhya Ramachandran , Wenjie Mao
IPC分类号: H02M3/07 , G05F3/10 , H01L29/66 , H01L23/00 , H01L23/522
摘要: Power management systems are described. In an embodiment, a power management system includes a voltage source, a circuit load located within a chip, and a switched capacitor voltage regulator (SCVR) coupled to voltage source and the circuit load to receive an input voltage from the voltage source and supply an output voltage to the circuit load. The SCVR may include circuitry located within the chip and a discrete integrated passive device (IPD) connected to the chip.
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