公开(公告)号：US20180220525A1

公开(公告)日：2018-08-02

申请号：US15935899

申请日：2018-03-26

Applicant: Apple Inc.

Inventor： Yanfeng CHEN ,  Shankar S. PENNATHUR

IPC: H05K1/02 ,  H05K9/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30

CPC classification number: H05K1/0216 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/18 ,  H05K3/284 ,  H05K3/30 ,  H05K9/00 ,  H05K9/0081 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2203/1322 ,  Y10T29/49146

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

公开(公告)号：US20150271911A1

公开(公告)日：2015-09-24

申请号：US14308463

申请日：2014-06-18

Applicant: Apple Inc.

Inventor： Yanfeng CHEN ,  Shankar S. PENNATHUR

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/30 ,  H05K1/18 ,  H05K9/00

CPC classification number: H05K1/0216 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/18 ,  H05K3/284 ,  H05K3/30 ,  H05K9/00 ,  H05K9/0081 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2203/1322 ,  Y10T29/49146

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

Abstract translation: 公开了一种封装在系统级封装中的便携式电子设备。 便携式电子设备可以包括基板和安装在基板上并包括在一个或多个子系统中的多个部件。 通过在部件之间设置绝缘层，在子系统之间形成窄沟槽，以及在绝缘层上沉积多层薄膜堆叠的一层或多层并填充沟槽，可以减少或消除子系统之间或外部源之间的干扰。 在一些实例中，多层薄膜堆叠可以包括粘附层，屏蔽层，保护层和化妆品层。 在一些实例中，多层薄膜堆叠可以包括多功能层，例如保护和化妆品层。