公开(公告)号：US20180220525A1

公开(公告)日：2018-08-02

申请号：US15935899

申请日：2018-03-26

Applicant: Apple Inc.

Inventor： Yanfeng CHEN ,  Shankar S. PENNATHUR

IPC: H05K1/02 ,  H05K9/00 ,  H05K1/18 ,  H05K3/28 ,  H05K3/30

CPC classification number: H05K1/0216 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/18 ,  H05K3/284 ,  H05K3/30 ,  H05K9/00 ,  H05K9/0081 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2203/1322 ,  Y10T29/49146

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

公开(公告)号：US20150382448A1

公开(公告)日：2015-12-31

申请号：US14503067

申请日：2014-09-30

Applicant: APPLE INC.

Inventor： Shankar S. PENNATHUR ,  Carlos A.S. RIBAS ,  Deniz TEOMAN ,  Michael ENG

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/28

CPC classification number: H05K1/0212 ,  G06F1/20 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/552 ,  H01L2224/16227 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/023 ,  H05K3/284 ,  H05K3/303 ,  H01L2924/00

Abstract: A compact portable electronic device packaged into a System-in-Package assembly and thermal solutions for the device is disclosed. The compact portable electronic device can be assembled into a single package to reduce size and enhance form factor. Several tens or hundreds of components including multiple dies, passive components, mechanical or optical components can be packaged into a single system on a printed circuit board. One or more of the components can dissipate a lot of power resulting in the generation of excess heat. To remove the excess heat, the device can include one or more thermal solutions such as internal thermal plugs, heat spreaders, internal embedded heat sinks, and/or external heat sinks. In some examples, the thermal solutions can dissipate heat via conduction to the bottom of the substrate or via convection to the top of the system or a combination of both.

Abstract translation: 公开了一种紧凑的便携式电子设备，其被封装成系统级封装组件和该器件的热解决方案。 紧凑型便携式电子设备可以组装成单个包装以减小尺寸并增强外形尺寸。 包括多个管芯，无源部件，机械或光学部件的数十或数百个部件可以封装在印刷电路板上的单个系统中。 一个或多个组件可以耗散大量的功率，导致产生过多的热量。 为了去除多余的热量，该装置可以包括一个或多个热解决方案，例如内部热插塞，散热器，内部嵌入式散热器和/或外部散热器。 在一些实例中，热解决方案可以通过导电散热到衬底的底部，或通过对系统的顶部或二者的组合来散热。

公开(公告)号：US20150271911A1

公开(公告)日：2015-09-24

申请号：US14308463

申请日：2014-06-18

Applicant: Apple Inc.

Inventor： Yanfeng CHEN ,  Shankar S. PENNATHUR

IPC: H05K1/02 ,  H05K3/28 ,  H05K3/30 ,  H05K1/18 ,  H05K9/00

CPC classification number: H05K1/0216 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/18 ,  H05K3/284 ,  H05K3/30 ,  H05K9/00 ,  H05K9/0081 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2203/1322 ,  Y10T29/49146

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer.

Abstract translation: 公开了一种封装在系统级封装中的便携式电子设备。 便携式电子设备可以包括基板和安装在基板上并包括在一个或多个子系统中的多个部件。 通过在部件之间设置绝缘层，在子系统之间形成窄沟槽，以及在绝缘层上沉积多层薄膜堆叠的一层或多层并填充沟槽，可以减少或消除子系统之间或外部源之间的干扰。 在一些实例中，多层薄膜堆叠可以包括粘附层，屏蔽层，保护层和化妆品层。 在一些实例中，多层薄膜堆叠可以包括多功能层，例如保护和化妆品层。