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公开(公告)号：US20240280767A1
公开(公告)日：2024-08-22
申请号：US18440193
申请日：2024-02-13
Applicant: Apple Inc.
Inventor： Jeremy D. Witmer , Jeffrey T. Hill , Yipin Wu , Zhechao Wang
IPC: G02B6/42
CPC classification number: G02B6/423
Abstract: An integrated photonic system including multiple photonic dies that are laterally aligned using contact between pairs of vertical surfaces. The vertical surfaces can be manufactured by defining, via photolithography processes for example, the shape of the vertical surfaces. Thereafter, the vertical surfaces can be aligned and engaged, thereby optically and mechanically intercoupling the multiple photonic dies.
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