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公开(公告)号:US20240332319A1
公开(公告)日:2024-10-03
申请号:US18613001
申请日:2024-03-21
Applicant: Apple Inc.
Inventor: Gihoon Choo , Abbas Jamshidi Roudbari , Guanxiong Liu , Jae Won Choi , Kyounghwan Kim , Shyuan Yang , Sungki Lee , Ting-Kuo Chang , Tsung-Ting Tsai , Wan-Ching Hsu , Warren S Rieutort-Louis , Yishan Liu , Zhe Hua
IPC: H01L27/12 , H01L25/16 , H01L25/18 , H01L23/00 , H01L23/498
CPC classification number: H01L27/1248 , H01L25/167 , H01L25/18 , H01L27/1259 , H01L23/4985 , H01L24/16 , H01L24/32 , H01L24/73 , H01L27/124 , H01L2224/16145 , H01L2224/32227 , H01L2224/73203 , H01L2924/1426
Abstract: An electronic device may include a substrate, an array of display pixels formed on the substrate, first conductive contacts on the substrate, second conductive contacts on the substrate, a flexible printed circuit that is attached to the first conductive contacts, a display driver integrated circuit that is attached to the second conductive contacts, and conductive traces that electrically connect the first conductive contacts to the second conductive contacts. A dielectric layer may cover at least the sidewalls of the conductive traces to protect the conductive traces from damage by an etchant. Subsequently, some or all of the dielectric layer may be removed to prevent damage caused by moisture ingress into the cladding layer.