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公开(公告)号：US20220336342A1
公开(公告)日：2022-10-20
申请号：US17230774
申请日：2021-04-14
Applicant: Apple Inc.
Inventor： Zheng Zhou , Jun Chung Hsu
IPC: H01L23/528 , H01Q1/22 , H01L23/66
Abstract: Routing substrates, methods of manufacture, and electronic assemblies including routing substrates are described. In an embodiment, a routing substrate includes a metal routing layer including a first set of first wiring traces and a second set of second wiring traces, where first top surfaces of the first wiring traces are characterized by a lower RMS surface roughness (Rq) than the second top surfaces of the second wiring traces.
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