High temperature substrate transfer robot
    1.
    发明申请
    High temperature substrate transfer robot 审中-公开
    高温基板传送机器人

    公开(公告)号:US20030014155A1

    公开(公告)日:2003-01-16

    申请号:US10201490

    申请日:2002-07-22

    IPC分类号: G06F007/00

    摘要: Generally, a robot for transferring a substrate in a processing system is provided. In one embodiment, a robot for transferring a substrate in a processing system includes a body, a linkage and an end effector that is adapted to retain the substrate thereon. The linkage couples the end effector to the body. The end effector and/or the linkage is comprised of a material having a coefficient of thermal expansion less than 5null10null6 Knull1. In another embodiment, the end effector and/or the linkage is comprised of a material having a ratio of thermal conductivity/thermal expansion greater than 1null107 W/(mnullK2). In yet another embodiment, the end effector and/or the linkage is comprised of a material having a ratio of thermal conductivity/thermal expansion greater than 1null107 W/(mnullK2) and a fracture toughness greater than 1null106 Pa m0.5.

    摘要翻译: 通常,提供了用于在处理系统中传送基板的机器人。 在一个实施例中,用于在处理系统中传送衬底的机器人包括主体,连杆以及适于将衬底保持在其上的端部执行器。 连杆将末端执行器连接到身体。 端部执行器和/或连杆由具有小于5×10 -6 K -1的热膨胀系数的材料组成。 在另一个实施例中,末端执行器和/或连杆由具有大于1×107W /(m.K2)的热导率/热膨胀率的材料组成。 在另一个实施例中,端部执行器和/或连杆由具有大于1×10 7 W /(m.K 2)的热导率/热膨胀比和大于1×10 6 Pa m0.5的断裂韧性的材料构成。