公开(公告)号：US20040079746A1

公开(公告)日：2004-04-29

申请号：US10280660

申请日：2002-10-24

Applicant: Applied Materials, Inc.

Inventor： Dean Jennings ,  Joseph M. Ranish ,  Brian Haas ,  Ajit Balakrishna ,  Sundar Ramamurthy ,  Aaron Hunter ,  Mark Yam

IPC: F27D011/00 ,  F27B005/14

CPC classification number: H01L21/67248 ,  F27B5/16 ,  F27B17/0025 ,  F27D19/00 ,  F27D21/0014 ,  H01L21/67115

Abstract: In a system for thermal processing of a semiconductor substrate, a reflector plate has a stepped surface facing the substrate during heating and cooling of the substrate. The raised surface of the reflector plate has reduced reflectivity, providing advantages during, among other things, cooling of the substrate. The reflector plate also includes a number of recesses to which one or more pyrometers are coupled. These recesses have a highly reflective surface, providing advantages in the performance of the pyrometers.

Abstract translation: 在半导体衬底的热处理系统中，反射板在衬底的加热和冷却期间具有面向衬底的台阶表面。 反射板的凸起表面具有降低的反射率，在基板的冷却等方面提供了优点。 反射板还包括多个凹槽，一个或多个高温计与之连接。 这些凹槽具有高度反射的表面，在高温计的性能方面具有优势。