公开(公告)号：US20040058560A1

公开(公告)日：2004-03-25

申请号：US10251485

申请日：2002-09-20

Applicant: APPLIED MATERIALS, INC.

Inventor： Joseph Ranish ,  Dean Jennings ,  Brian Haas

IPC: H01L021/26 ,  H01L021/324 ,  H01L021/477

CPC classification number: H01L21/67115 ,  F27B17/0025 ,  F27D19/00 ,  F27D21/0014 ,  H01L21/324 ,  H01L21/67109 ,  H01L21/67248

Abstract: A method for thermally processing a semiconductor substrate comprises: heating the substrate to a target peak temperature while controlling the gas pressure in the processing chamber at a pressure level that is significantly lower than atmospheric pressure; providing a flow of a purge gas between the substrate and a thermal reservoir at or near the time the substrate temperature reaches the target peak temperature while adjusting the gas pressure in the processing chamber to a second pressure level. Preferably, the purge gas has a relatively high thermal conductivity.

Abstract translation: 一种用于热处理半导体衬底的方法包括：将衬底加热到​​目标峰值温度，同时以显着低于大气压力的压力水平控制处理室中的气体压力; 在基板温度达到目标峰值温度的时刻或接近基板和热储存器之间提供净化气体流，同时将处理室中的气体压力调节到第二压力水平。 优选地，吹扫气体具有相对高的导热性。

公开(公告)号：US20040079746A1

公开(公告)日：2004-04-29

申请号：US10280660

申请日：2002-10-24

Applicant: Applied Materials, Inc.

Inventor： Dean Jennings ,  Joseph M. Ranish ,  Brian Haas ,  Ajit Balakrishna ,  Sundar Ramamurthy ,  Aaron Hunter ,  Mark Yam

IPC: F27D011/00 ,  F27B005/14

CPC classification number: H01L21/67248 ,  F27B5/16 ,  F27B17/0025 ,  F27D19/00 ,  F27D21/0014 ,  H01L21/67115

Abstract: In a system for thermal processing of a semiconductor substrate, a reflector plate has a stepped surface facing the substrate during heating and cooling of the substrate. The raised surface of the reflector plate has reduced reflectivity, providing advantages during, among other things, cooling of the substrate. The reflector plate also includes a number of recesses to which one or more pyrometers are coupled. These recesses have a highly reflective surface, providing advantages in the performance of the pyrometers.

Abstract translation: 在半导体衬底的热处理系统中，反射板在衬底的加热和冷却期间具有面向衬底的台阶表面。 反射板的凸起表面具有降低的反射率，在基板的冷却等方面提供了优点。 反射板还包括多个凹槽，一个或多个高温计与之连接。 这些凹槽具有高度反射的表面，在高温计的性能方面具有优势。