公开(公告)号：US20200041211A1

公开(公告)日：2020-02-06

申请号：US16508598

申请日：2019-07-11

Applicant: Applied Materials, Inc.

Inventor： Manoj A. GAJENDRA ,  Arul Vasanth SUBRAMANIAN

IPC: F28D1/053 ,  H01L21/67 ,  H01J37/32

Abstract: Embodiments described herein relate to a heat exchanger for abating compounds produced in semiconductor processes. When hot effluent flows into the heat exchanger, a coolant can be flowed to walls of a heat exchanging surface within the heat exchanger. The heat exchanging surface can be a curved shaped which creates a multi stage cross flow path for the hot effluent to flow down the heat exchanger. This flow path forces the hot effluent to hit the cold walls of the heat exchanging surface, significantly cooling the effluent and preventing it from flowing directly into the vacuum pumps and causing heat damage. Embodiments described herein also relate to methods of forming a heat exchanger. The heat exchanger can be created by sequentially depositing layers of thermally conductive material on surfaces using 3-D printing, creating a much smaller foot print and reducing costs.