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    SUBSTRATE POSITION ALIGNER
    2.
    发明申请
    SUBSTRATE POSITION ALIGNER 有权
    基板位置对准器

    公开(公告)号：US20140271085A1

    公开(公告)日：2014-09-18

    申请号：US14195343

    申请日：2014-03-03

    申请人： Applied Materials, Inc.

    发明人： Manoj A. GAJENDRA

    IPC分类号： H01L21/68

    CPC分类号： H01L21/681 ,  H01L21/67242 ,  H01L21/68 ,  Y10S414/136

    摘要： A substrate position aligner includes a substrate holding assembly, a plurality of rollers, a rotation mechanism, and a sensor. The substrate holding assembly is configured to hold a substrate in a vertical orientation. The plurality of rollers include at least two idler rollers and a drive roller. Each roller has a point on its perimeter spaced on a common radius from a center of substrate rotation defined within the substrate holding assembly. The sensor is positioned approximately on the common radius and configured to detect the presence of an orientation cut in the substrate when the orientation cut is not orientated within a range between about −44 degrees and about +44 degrees from horizontal. A method of aligning a substrate having an orientation cut includes sensing a presence of the orientation cut when the orientation cut is not orientated within the above recited range.

    摘要翻译： 基板位置对准器包括基板保持组件，多个滚子，旋转机构和传感器。 衬底保持组件被配置为将衬底保持在垂直取向。 多个辊包括至少两个惰辊和驱动辊。 每个辊子在其周边上具有一个点，该点与衬底保持组件中限定的衬底旋转中心的公共半径间隔开。 传感器大致位于公共半径上并被配置为当定向切割不定向在与水平面约-44度和约+ 44度之间的范围内时，检测衬底中存在取向切割。 对准具有取向切割的基板的方法包括：当取向切口不在上述范围内时定向切割的存在。

    APPARATUS WITH MULTISTAGED COOLING
    3.
    发明申请
    APPARATUS WITH MULTISTAGED COOLING 审中-公开

    公开(公告)号：US20200041211A1

    公开(公告)日：2020-02-06

    申请号：US16508598

    申请日：2019-07-11

    申请人： Applied Materials, Inc.

    发明人： Manoj A. GAJENDRA ,  Arul Vasanth SUBRAMANIAN

    IPC分类号： F28D1/053 ,  H01L21/67 ,  H01J37/32

    摘要： Embodiments described herein relate to a heat exchanger for abating compounds produced in semiconductor processes. When hot effluent flows into the heat exchanger, a coolant can be flowed to walls of a heat exchanging surface within the heat exchanger. The heat exchanging surface can be a curved shaped which creates a multi stage cross flow path for the hot effluent to flow down the heat exchanger. This flow path forces the hot effluent to hit the cold walls of the heat exchanging surface, significantly cooling the effluent and preventing it from flowing directly into the vacuum pumps and causing heat damage. Embodiments described herein also relate to methods of forming a heat exchanger. The heat exchanger can be created by sequentially depositing layers of thermally conductive material on surfaces using 3-D printing, creating a much smaller foot print and reducing costs.

    HEAT EXCHANGER WITH MULTISTAGED COOLING
    5.
    发明申请
    HEAT EXCHANGER WITH MULTISTAGED COOLING 有权

    公开(公告)号：US20220178617A1

    公开(公告)日：2022-06-09

    申请号：US17679824

    申请日：2022-02-24

    申请人： Applied Materials, Inc.

    发明人： Manoj A. GAJENDRA

    IPC分类号： F28D1/02 ,  F28F9/00

    摘要： Embodiments described herein relate to a heat exchanger for abating compounds produced in semiconductor processes. When hot effluent flows into the heat exchanger, a coolant can be flowed to walls of a fluid heat exchanging surface within the heat exchanger. The heat exchanging surface can include a plurality of channel regions which creates a multi stage cross flow path for the hot effluent to flow down the heat exchanger. This flow path forces the hot effluent to hit the cold walls of the fluid heat exchanging surface, significantly cooling the effluent and preventing it from flowing directly into the vacuum pumps and causing heat damage. Embodiments described herein also relate to methods of forming a heat exchanger. The heat exchanger can be created by sequentially depositing layers of thermally conductive material on surfaces using 3-D printing, creating a much smaller footprint and reducing costs.