Abstract:
A support for a substrate processing chamber has upper and lower walls that are joined by a peripheral sidewall to define a reservoir. A fluid inlet supplies a heat transfer fluid to the reservoir. In one version, a plurality of protrusions extends into the reservoir to perturb the flow of the heat transfer fluid through the reservoir. In another version, the reservoir is an elongated channel having one or more of (i) serpentine convolutions, (ii) integral fins extending into the channel, (iii) a roughened internal surface, or (iv) a changing cross-section. A fluid outlet discharges the heat transfer fluid from the reservoir.
Abstract:
Various embodiments of the invention are generally directed to an apparatus for supporting a substrate in a processing chamber. In one embodiment, the invention is directed to a chuck made of a dielectric material sintered with binders and a protective layer disposed on the chuck. The protective layer is made from a dielectric material. In another embodiment, the invention is directed to a method for fabricating a chuck. The method includes providing a chuck having an upper surface and a side peripheral surface, introducing dielectric powder particles into a combustible gas mixture, combusting the dielectric powder particles and the gas mixture together, and propelling the combusted powder particles onto the chuck to form a protective layer over at least one of the upper surface and the side peripheral surface of the chuck.