公开(公告)号：US20240153795A1

公开(公告)日：2024-05-09

申请号：US17981278

申请日：2022-11-04

Applicant: Applied Materials, Inc.

Inventor： Adam Fischbach ,  Richard McKissick ,  Brian Hatcher ,  Christian Valencia ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/68

CPC classification number: H01L21/6719 ,  H01J37/32192 ,  H01L21/681

Abstract: Embodiments disclosed herein include a semiconductor processing tool. In an embodiment, the semiconductor processing tool comprises a chamber, and a lid configured to seal the chamber. In an embodiment, a modular microwave plasma applicator is provided through the lid, and an optical port is provided through the lid and adjacent to the modular microwave plasma source. In an embodiment, a pin is inserted in the optical port.