公开(公告)号：US20220254641A1

公开(公告)日：2022-08-11

申请号：US17174224

申请日：2021-02-11

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Christian Valencia ,  Chikuang Wang ,  Bencherki Mebarki ,  Hanh Nguyen ,  Philip Allan Kraus

IPC: H01L21/285 ,  H01L23/532 ,  H01J37/32 ,  C23C16/26 ,  C23C16/02 ,  C23C16/511

Abstract: Embodiments disclosed herein include methods and apparatuses used to deposit graphene layers. In an embodiment, a method of depositing a graphene layer on a substrate comprises providing a substrate within a modular microwave plasma chamber, and flowing a carbon source and a hydrogen source into the modular microwave plasma chamber. In an embodiment, the method further comprises striking a plasma in the modular microwave plasma chamber, where a substrate temperature is below approximately 400° C., and depositing the graphene layer on the substrate.

公开(公告)号：US20240379331A1

公开(公告)日：2024-11-14

申请号：US18144745

申请日：2023-05-08

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Kelvin Chan ,  Adam Fischbach ,  Farzad Houshmand ,  Christian Valencia ,  Philip Allan Kraus

IPC: H01J37/32 ,  H05H1/46

Abstract: Embodiments disclosed herein include an applicator for microwave plasma generation. In an embodiment, the applicator comprises a resonator body with a hole into an axial center of the resonator body, where the resonator body comprises a first dielectric material. In an embodiment, the applicator further comprises a pin inserted into the hole, where the pin is an electrically conductive material. In an embodiment, the applicator further comprises a plate under the resonator body, where the plate comprises a second dielectric material that is different than the first dielectric material.

公开(公告)号：US12300497B2

公开(公告)日：2025-05-13

申请号：US17174224

申请日：2021-02-11

Applicant: Applied Materials, Inc.

Inventor： Thai Cheng Chua ,  Christian Valencia ,  Chikuang Wang ,  Bencherki Mebarki ,  Hanh Nguyen ,  Philip Allan Kraus

IPC: C23C16/00 ,  C23C16/02 ,  C23C16/26 ,  C23C16/511 ,  H01J37/32 ,  H01L21/285

Abstract: Embodiments disclosed herein include methods and apparatuses used to deposit graphene layers. In an embodiment, a method of depositing a graphene layer on a substrate comprises providing a substrate within a modular microwave plasma chamber, and flowing a carbon source and a hydrogen source into the modular microwave plasma chamber. In an embodiment, the method further comprises striking a plasma in the modular microwave plasma chamber, where a substrate temperature is below approximately 400° C., and depositing the graphene layer on the substrate.

公开(公告)号：US20250043413A1

公开(公告)日：2025-02-06

申请号：US18228555

申请日：2023-07-31

Applicant: Applied Materials, Inc.

Inventor： Sze Chieh Yvonne Tan ,  Vicknesh Sahmuganathan ,  John Sudijono ,  Philip Allan Kraus ,  Christian Valencia ,  Thai Cheng Chua

IPC: C23C16/27 ,  C23C16/02 ,  C23C16/511 ,  C23C16/52

Abstract: Embodiments include a modular high-frequency emission source for growth of a low roughness nanocrystalline diamond film. In an embodiment, a method of fabricating a nanocrystalline diamond (NCD) film includes loading a nanodiamond-seeded silicon wafer or a bare silicon wafer that has been surface-treated and incubated into a microwave plasma-enhanced chemical vapor deposition (MWPECVD) chamber, and processing the nanodiamond-seeded silicon wafer or the bare silicon wafer that has been surface-treated and incubated with a plasma of CxHy (y≥x), CO2 and H2, at power greater than 50 W, to form a layer of nanocrystalline diamond thereon.

公开(公告)号：US20240153795A1

公开(公告)日：2024-05-09

申请号：US17981278

申请日：2022-11-04

Applicant: Applied Materials, Inc.

Inventor： Adam Fischbach ,  Richard McKissick ,  Brian Hatcher ,  Christian Valencia ,  Thai Cheng Chua ,  Philip Allan Kraus

IPC: H01L21/67 ,  H01J37/32 ,  H01L21/68

CPC classification number: H01L21/6719 ,  H01J37/32192 ,  H01L21/681

Abstract: Embodiments disclosed herein include a semiconductor processing tool. In an embodiment, the semiconductor processing tool comprises a chamber, and a lid configured to seal the chamber. In an embodiment, a modular microwave plasma applicator is provided through the lid, and an optical port is provided through the lid and adjacent to the modular microwave plasma source. In an embodiment, a pin is inserted in the optical port.