CMP PADS HAVING MATERIAL COMPOSITION THAT FACILITATES CONTROLLED CONDITIONING
    1.
    发明申请
    CMP PADS HAVING MATERIAL COMPOSITION THAT FACILITATES CONTROLLED CONDITIONING 有权
    CMP PADS具有控制调节的材料组成

    公开(公告)号:US20150044951A1

    公开(公告)日:2015-02-12

    申请号:US14454785

    申请日:2014-08-08

    CPC classification number: B24B37/245

    Abstract: Embodiments of the disclosure generally provides a method and apparatus for a polishing article or polishing pad having a microstructure that facilitates uniform conditioning when exposed to laser energy. In one embodiment, a polishing pad comprising a combination of a first material and a second material is provided, and the first material is more reactive to laser energy than the second material. In another embodiment, a method of texturing a composite polishing pad is provided. The method includes directing a laser energy source onto a surface of the polishing pad to affect a greater ablation rate within a first material having a greater laser absorption rate and a lesser ablation rate within a second material having a lesser laser absorption rate to provide a micro-textured surface consistent with microstructure of the composite polishing pad.

    Abstract translation: 本公开的实施例通常提供了一种用于抛光制品或抛光垫的方法和装置,其具有当暴露于激光能量时有助于均匀调理的微结构。 在一个实施例中,提供了包括第一材料和第二材料的组合的抛光垫,并且第一材料比第二材料对激光能量更有反应性。 在另一个实施例中,提供纹理化复合抛光垫的方法。 该方法包括将激光能量源引导到抛光垫的表面上以影响具有较大激光吸收率的第一材料内具有更大的消融速率,并且在具有较小激光吸收率的第二材料内具有较小的烧蚀速率以提供微观 表面与复合抛光垫的微结构一致。

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