公开(公告)号：US20200027769A1

公开(公告)日：2020-01-23

申请号：US16037975

申请日：2018-07-17

Applicant: Applied Materials, Inc.

Inventor： Jonathan SIMMONS ,  Dana LOVELL

IPC: H01L21/683 ,  H01L21/67

Abstract: The present disclosure generally relates to an electrostatic chuck for processing substrates. The electrostatic chuck includes a facilities plate and an insulator disposed between a cooling base and a ground plate. A support body is coupled to the cooling base for supporting a substrate thereon. A ring is configured to surround the insulator. The ring is formed from a material that is resistant to degradation from exposure to a manufacturing process. The ring optionally includes an extension configured to surround the facilities plate.