公开(公告)号：US12076877B2

公开(公告)日：2024-09-03

申请号：US16884888

申请日：2020-05-27

Applicant: Applied Materials, Inc.

Inventor： Bum Jick Kim ,  Danielle Loi ,  Jay Gurusamy ,  Steven M. Zuniga

IPC: B26D3/00 ,  B23B1/00 ,  B24B37/10 ,  B24B37/11 ,  B24B37/30 ,  B24B41/04 ,  B24D3/00 ,  B26D1/02

CPC classification number: B26D3/006 ,  B23B1/00 ,  B24B37/10 ,  B24B37/11 ,  B24B37/30 ,  B24B41/04 ,  B24D3/00 ,  B26D1/02

Abstract: Embodiments of the present disclosure generally relate to methods of manufacturing polishing platens for use on a chemical mechanical polishing (CMP) system and polishing platens formed therefrom. A method of manufacturing a polishing includes positioning a polishing platen on a support of a manufacturing system. The manufacturing system includes the support and a cutting tool facing there towards. Here, the polishing platen includes a cylindrical metal body having a polymer layer disposed on a surface thereof and the polymer layer has a thickness of about 100 μm or more. The method further includes removing at least a portion of the polymer layer using the cutting tool to form a polishing pad-mounting surface. Beneficially, the method may be used to form a pad-mounting surface having a desired flatness or shape, such as a concave or convex shape.

公开(公告)号：US11919120B2

公开(公告)日：2024-03-05

申请号：US17185873

申请日：2021-02-25

Applicant: Applied Materials, Inc.

Inventor： David J. Lischka ,  Jay Gurusamy ,  Danielle Loi ,  Steven M. Zuniga

IPC: B24B37/20 ,  B24B37/005

CPC classification number: B24B37/005 ,  B24B37/20

Abstract: A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially outward from the platen to support an outer polishing pad. The annular flange has an inner edge secured to and rotatable with the platen and vertically fixed relative to the top surface of the platen. The annular flange is vertically deflectable such that an outer edge of the annular flange is vertically moveable relative to the inner edge. An actuator applies pressure to an underside of the annular flange in an angularly limited region, and a carrier head holds a substrate in contact with the polishing pad and is movable to selectively position a portion of the substrate over the outer polishing pad.

公开(公告)号：US20220266413A1

公开(公告)日：2022-08-25

申请号：US17185873

申请日：2021-02-25

Applicant: Applied Materials, Inc.

Inventor： David J. Lischka ,  Jay Gurusamy ,  Danielle Loi ,  Steven M. Zuniga

IPC: B24B37/005 ,  B24B37/20

Abstract: A polishing system includes a platen having a top surface to support a main polishing pad. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen. An annular flange projects radially outward from the platen to support an outer polishing pad. The annular flange has an inner edge secured to and rotatable with the platen and vertically fixed relative to the top surface of the platen. The annular flange is vertically deflectable such that an outer edge of the annular flange is vertically moveable relative to the inner edge. An actuator applies pressure to an underside of the annular flange in an angularly limited region, and a carrier head holds a substrate in contact with the polishing pad and is movable to selectively position a portion of the substrate over the outer polishing pad.