公开(公告)号：US20210175103A1

公开(公告)日：2021-06-10

申请号：US16705963

申请日：2019-12-06

Applicant: Applied Materials, Inc.

Inventor： Srivatsa Madananth ,  Dhananjai Kumar ,  Yogananda Sarode Vishwanath ,  Jacob Andrews

IPC: H01L21/67 ,  H01J37/32 ,  G01H1/00

Abstract: Exemplary semiconductor processing chambers may include a chamber body defining a substrate processing region. The chambers may include a substrate support positioned within the substrate processing region. The substrate support may include a ceramic or polymeric insulator plate positioned between a cathode assembly and an electrostatic chuck assembly. The chambers may include an acoustic emission probe in contact with the insulator plate of the substrate support.