-
公开(公告)号：US12100576B2
公开(公告)日：2024-09-24
申请号：US16863541
申请日：2020-04-30
发明人： Andrew Nguyen , Xue Yang Chang , Yu Lei , Xianmin Tang , John C. Forster , Yogananda Sarode Vishwanath , Abilash Sainath , Tza-Jing Gung
CPC分类号： H01J37/32477 , C23C16/4412 , H01J37/3244 , H01J37/32495 , H01J37/32633 , H01J37/32651
摘要： Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a chamber liner having a tubular body with an upper portion and a lower portion; a confinement plate coupled to the lower portion of the chamber liner and extending radially inward from the chamber liner, wherein the confinement plate includes a plurality of slots; a shield ring disposed within the chamber liner and movable between the upper portion of the chamber liner and the lower portion of the chamber liner; and a plurality of ground straps coupled to the shield ring at a first end of each ground strap of the plurality of ground straps and to the confinement plate at a second end of each ground strap to maintain electrical connection between the shield ring and the chamber liner when the shield ring moves.
-
公开(公告)号：US20240183656A1
公开(公告)日：2024-06-06
申请号：US18401881
申请日：2024-01-02
IPC分类号： G01B11/30 , H01J37/32 , H01L21/683 , H01L21/687
CPC分类号： G01B11/303 , H01J37/32495 , H01J37/32642 , H01J37/32715 , H01J37/32807 , H01L21/6833 , H01L21/68742 , H01J2237/24495 , H01J2237/24592
摘要： A diagnostic disc includes a disc body having a sidewall around a circumference of the disc body and at least one protrusion extending outwardly from a top of the sidewall. A non-contact sensor is attached to an underside of each of the at least one protrusion. A printed circuit board (PCB) is positioned within an interior formed by the disc body. Circuitry is disposed on the PCB and coupled to each non-contact sensor, the circuitry including at least a wireless communication circuit, a memory, and a battery. A cover is positioned over the circuitry inside of the sidewall, where the cover seals the circuitry within the interior formed by the disc body from an environment outside of the disc body.
-
公开(公告)号：US12002703B2
公开(公告)日：2024-06-04
申请号：US17227066
申请日：2021-04-09
IPC分类号： H01L21/687 , C23C16/44 , H01J37/32 , H01L21/67 , H01L21/683
CPC分类号： H01L21/68742 , C23C16/4401 , H01J37/32715 , H01L21/67017 , H01L21/67103 , H01L21/67109 , H01L21/6831 , H01L21/6833 , H01L21/68757 , H01L21/68785 , H01J37/32449 , H01L21/67069
摘要： Apparatuses for substrate transfer are provided. A lift pin assembly can include a lift pin, a purge cylinder, and a lift pin guide. The lift pin guide is disposed adjacent the purge cylinder. The lift pin guide and the purge cylinder have a passage formed therethrough in which the lift pin is disposed. The purge cylinder includes one or more nozzles that direct the flow of gas radially inward into a portion of the passage disposed in the purge cylinder. The one or more nozzles are disposed radially outward from the lift pin. The purge cylinder reduces particle deposition on the substrate by preventing contact between the lift pin and the support assembly as the lift pin is in motion.
-
公开(公告)号：US11913777B2
公开(公告)日：2024-02-27
申请号：US16946147
申请日：2020-06-08
IPC分类号： G01B11/30 , H01J37/32 , H01L21/687 , H01L21/683
CPC分类号： G01B11/303 , H01J37/32495 , H01J37/32642 , H01J37/32715 , H01J37/32807 , H01L21/6833 , H01L21/68742 , H01J2237/24495 , H01J2237/24592
摘要： A diagnostic disc includes a disc body having a sidewall around a circumference of the disc body and at least one protrusion extending outwardly from a top of the sidewall. A non-contact sensor is attached to an underside of each of the at least one protrusion. A a printed circuit board (PCB) is positioned within an interior formed by the disc body. Circuitry is disposed on the PCB and coupled to each non-contact sensor, the circuitry including at least a wireless communication circuit, a memory, and a battery. A cover is positioned over the circuitry inside of the sidewall, wherein the cover seals the circuitry within the interior formed by the disc body from an environment outside of the disc body.
-
公开(公告)号：US20210175103A1
公开(公告)日：2021-06-10
申请号：US16705963
申请日：2019-12-06
摘要： Exemplary semiconductor processing chambers may include a chamber body defining a substrate processing region. The chambers may include a substrate support positioned within the substrate processing region. The substrate support may include a ceramic or polymeric insulator plate positioned between a cathode assembly and an electrostatic chuck assembly. The chambers may include an acoustic emission probe in contact with the insulator plate of the substrate support.
-
公开(公告)号：US20200373190A1
公开(公告)日：2020-11-26
申请号：US16417348
申请日：2019-05-20
发明人： Helder Lee , Nicholas Michael Kopec , Leon Volfovski , Douglas R. McAllister , Andreas Schmid , Jeffrey Hudgens , Yogananda Sarode Vishwanath , Steven Babayan
IPC分类号： H01L21/687 , H01L21/673 , H01L21/68 , H01L21/677
摘要： A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.
-
公开(公告)号：US10381200B2
公开(公告)日：2019-08-13
申请号：US15453868
申请日：2017-03-08
摘要： A method and apparatus for processing substrates in tandem processing regions of a plasma chamber is provided. In one example, the apparatus is embodied as a plasma chamber that includes a chamber body having a first chamber side with a first processing region and a second chamber side with a second processing region. The chamber body has a front wall and a bottom wall. A first chamber side port, a second chamber side port, and a vacuum port are disposed through the bottom wall. The vacuum port is at least part of an exhaust path for each of the processing regions. A vacuum house extends from the front wall and defines a second portion of the vacuum port. A substrate support is disposed in each of the processing regions, and a stem is coupled to each substrate support. Each stem extends through a chamber side port.
-
公开(公告)号：US20240351055A1
公开(公告)日：2024-10-24
申请号：US18206852
申请日：2023-06-07
CPC分类号： B05B7/26 , B05B1/005 , B05B1/14 , B05B13/0278 , B33Y80/00
摘要： Example structures, methods, and systems for additive manufacturing of a gas hub and delivery nozzle are disclosed. One example structure includes a unitary gas hub and distribution nozzle that includes a gas hub portion and a gas delivery nozzle portion. The gas hub portion includes multiple gas inlet paths and one or more plenum chambers. The multiple gas inlet paths and the one or more plenum chambers form fully recursive gas paths. Each of the one or more plenum chambers has one or more output holes. The gas delivery nozzle portion includes multiple gas flow paths, where each gas flow path is coupled to one of the one or more output holes in each of the one or more plenum chambers, and each gas flow path has a respective output at an outer surface of the gas delivery nozzle portion.
-
公开(公告)号：US20240339302A1
公开(公告)日：2024-10-10
申请号：US18206456
申请日：2023-06-06
CPC分类号： H01J37/32449 , B33Y80/00 , H01J2237/334
摘要： Systems, methods, and apparatus including designs embodied in machine-readable media for a gas break used in semiconductor processing systems. The apparatus includes a gas break structure comprising an insulating material and having one or more gas flow paths formed within a body of the gas break structure, the gas break structure configured to provide a specified impedance when coupled between a grounded gas distribution manifold and an electrically charged gas delivery nozzle, the gas break structure further comprising an internal structure having a specified geometry comprising a repeating structure and one or more empty gaps between elements of the repeating structure. The gas break can be formed using additive manufacturing.
-
公开(公告)号：US11199267B2
公开(公告)日：2021-12-14
申请号：US16542798
申请日：2019-08-16
发明人： Andrew Nguyen , Yogananda Sarode Vishwanath , Xue Chang , Anilkumar Rayaroth , Chetan Naik , Balachandra Jatak Narayan
摘要： Embodiments of symmetric flow valves for use in a substrate processing chamber are provided herein. In some embodiments, a symmetric flow valve includes a valve body having sidewalls, a bottom plate, and a top plate that together define an interior volume, wherein the top plate includes one or more axisymmetrically disposed openings; a poppet disposed in the interior volume, wherein the poppet includes a central opening and a plurality of portions configured to selectively seal the one or more axisymmetrically disposed openings of the top plate when the symmetric flow valve is in a closed position; and a first actuator coupled to the poppet to position the poppet within the interior volume in at least an open position, where the poppet is spaced apart from the top plate to allow flow through the one or more axisymmetrically disposed openings of the top plate, and the closed position.
-
-
-
-
-
-
-
-
-
搜索结果
40 条记录 (耗时 0.022 秒)
