公开(公告)号：US20230286107A1

公开(公告)日：2023-09-14

申请号：US17691101

申请日：2022-03-09

Applicant: Applied Materials, Inc.

Inventor： Kun Xu ,  Patrick A. Higashi ,  Hassan G. Iravani ,  Harry Q. Lee ,  Haosheng Wu ,  Eric T. Wu ,  Ningzhuo Cui ,  Jeonghoon Oh ,  Christopher Lai ,  Jun Qian

IPC: B24B49/10 ,  B24B37/26

CPC classification number: B24B49/105 ,  B24B37/26

Abstract: A body is brought into contact with a polishing pad of a polishing system, a polishing liquid is supplied to the polishing pad, relative motion between the body and the polishing pad is generated while the body contacts the polishing pad, a signal from an in-situ eddy current monitoring system during the relative motion while the body contacts the polishing pad, generating, and mechanical vibrations in the polishing system are detected based on a signal from the in-situ eddy current monitoring system.