公开(公告)号：US08758086B2

公开(公告)日：2014-06-24

申请号：US13714202

申请日：2012-12-13

Applicant: Applied Materials, Inc.

Inventor： Gabriel Lorimer Miller ,  Manoocher Birang ,  Nils Johansson ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu

IPC: B24B49/00

CPC classification number: G01N19/02 ,  B24B37/013 ,  B24B49/16

Abstract: A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

Abstract translation: 描述了用于监测经历抛光的基底的摩擦系数的系统，方法和装置。 抛光垫组件包括包括抛光表面的抛光层，以及柔性地联接到抛光层上的衬底接触构件，其具有与衬底的暴露表面接触的顶表面。 顶表面的至少一部分与抛光表面基本共面。 提供传感器以测量基板接触构件的横向位移。 一些实施例可以在化学机械抛光期间提供准确的端点检测以指示下层的曝光。