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    Apparatus and method for in-situ endpoint detection for semiconductor processing operations
    1.
    发明授权
    Apparatus and method for in-situ endpoint detection for semiconductor processing operations 有权
    用于半导体处理操作的原位端点检测的装置和方法

    公开(公告)号：US08795029B2

    公开(公告)日：2014-08-05

    申请号：US13745691

    申请日：2013-01-18

    Applicant: Applied Materials, Inc.

    Inventor： Manoocher Birang ,  Nils Johansson ,  Allan Gleason

    IPC: B24B49/12

    CPC classification number: H01L22/12 ,  B24B37/013 ,  B24B37/205 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/0683

    Abstract: An endpoint detection method includes processing an outer surface of a substrate, directing an incident light beam through a window in an opaque metal body onto the surface being processed, receiving at a detector a reflected light beam from the substrate and generating a signal from the detector, and generating a signal based on the reflected light beam received at the detector, and detecting a processing endpoint. The signal is a time-varying cyclic signal that varies as the thickness of the layer varies over time, and detecting the processing endpoint includes detecting that a portion of a cycle of the cyclic signal has passed, the portion being less than a full cycle of the cyclic signal.

    Abstract translation: 端点检测方法包括处理衬底的外表面，将入射光束通过不透明金属体中的窗口引导到被处理的表面上，在检测器处接收来自衬底的反射光束，并从检测器产生信号 并且基于在检测器处接收的反射光产生信号，并且检测处理端点。 该信号是时变循环信号，其随着层的厚度随时间而变化，并且检测处理端点包括检测循环信号的周期的一部分已经过去，该部分小于全周期 循环信号。

    Friction sensor for polishing system
    2.
    发明授权
    Friction sensor for polishing system 有权
    抛光系统摩擦传感器

    公开(公告)号：US08758086B2

    公开(公告)日：2014-06-24

    申请号：US13714202

    申请日：2012-12-13

    Applicant: Applied Materials, Inc.

    Inventor： Gabriel Lorimer Miller ,  Manoocher Birang ,  Nils Johansson ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu

    IPC: B24B49/00

    CPC classification number: G01N19/02 ,  B24B37/013 ,  B24B49/16

    Abstract: A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

    Abstract translation: 描述了用于监测经历抛光的基底的摩擦系数的系统，方法和装置。 抛光垫组件包括包括抛光表面的抛光层，以及柔性地联接到抛光层上的衬底接触构件，其具有与衬底的暴露表面接触的顶表面。 顶表面的至少一部分与抛光表面基本共面。 提供传感器以测量基板接触构件的横向位移。 一些实施例可以在化学机械抛光期间提供准确的端点检测以指示下层的曝光。

    POLISHING PAD WITH TWO-SECTION WINDOW HAVING RECESS
    6.
    发明申请
    POLISHING PAD WITH TWO-SECTION WINDOW HAVING RECESS 审中-公开
    具有两部分窗户的抛光垫

    公开(公告)号：US20150004888A1

    公开(公告)日：2015-01-01

    申请号：US14485386

    申请日：2014-09-12

    Applicant: Applied Materials, Inc.

    Inventor： Boguslaw A. Swedek ,  Manoocher Birang

    IPC: B24B37/26

    CPC classification number: B24B37/26 ,  B24B37/013 ,  B24B37/205 ,  B24B49/02 ,  B24B49/10 ,  B24B49/105 ,  B24B49/12 ,  B24D11/02 ,  G01B7/105

    Abstract: A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.

    Abstract translation: 一种用具有研磨面和背面的研磨层形成研磨垫的方法。 在研磨面上形成有多个凹槽，在研磨层的背面形成有凹部。 与后表面的凹部对应的研磨面上的区域没有凹槽或具有较浅的凹槽。

    TRANSPARENT WINDOW IN A POLISHING PAD
    7.
    发明申请
    TRANSPARENT WINDOW IN A POLISHING PAD 审中-公开
    抛光窗中的透明窗

    公开(公告)号：US20140038501A1

    公开(公告)日：2014-02-06

    申请号：US14051308

    申请日：2013-10-10

    Applicant: Applied Materials, Inc.

    Inventor： Manoocher Birang ,  Allan Gleason ,  William L. Guthrie

    IPC: B24B37/20

    CPC classification number: B24B37/205 ,  B24B37/013 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/06 ,  G01B11/0683

    Abstract: A polishing pad assembly for a chemical mechanical polishing apparatus includes a polishing pad having a polishing surface and a surface opposite the polishing surface for attachment to a platen, and a solid light-transmissive window formed in the polishing pad. The light-transmissive window is more transmissive to light than the polishing pad. The light-transmissive window has a light-diffusing bottom surface.

    Abstract translation: 用于化学机械抛光装置的抛光垫组件包括抛光垫，抛光垫具有抛光表面和与抛光表面相对的表面，用于附接到压板，以及形成在抛光垫中的固体透光窗。 光透射窗比抛光垫更透光。 透光窗具有光扩散底面。

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