公开(公告)号：US20240112939A1

公开(公告)日：2024-04-04

申请号：US18372818

申请日：2023-09-26

Applicant: Applied Materials, Inc.

Inventor： Tony Jefferson GNANAPRAKASA ,  Alvaro GARCIA ,  Gautham BAMMANAHALLI ,  Tatsuichiro INOUE ,  Nathaniel MOORE

IPC: H01L21/683 ,  H01J37/32

CPC classification number: H01L21/6831 ,  H01J37/32715 ,  H01J2237/002 ,  H01J2237/2007

Abstract: Embodiments of this disclosure include methods of chucking and de-chucking a substrate. A method of chucking a substrate to a surface of an electrostatic chuck includes applying a first voltage to a chucking electrode in the ESC during a chucking time interval, supplying an inert gas at a first pressure to a backside of the substrate during the chucking time interval, applying a second voltage to the chucking electrode in the ESC after the chucking time interval, the second voltage being higher than the first voltage, and supplying the inert gas at a second pressure to the backside of the substrate after the chucking time interval, the second pressure being higher than the first pressure of the inert gas.