公开(公告)号：US20250010431A1

公开(公告)日：2025-01-09

申请号：US18274991

申请日：2022-08-18

Applicant: Applied Materials, Inc.

Inventor： Jianjun HU ,  Peng LIU ,  Colin John DICKINSON ,  Quoc TRUONG ,  Jamie Stuart LEIGHTON ,  Gopalakrishna B. PRABHU ,  John Howard GIVENS

IPC: B24B57/02 ,  B24B37/005 ,  B24B37/04

Abstract: The present disclosure generally relates to methods and system used to collect and reuse polishing fluids used during a chemical mechanical polishing (CMP) process for the fabrication of electronic devices. More specifically, systems and methods provided herein include a polishing fluid collection system having a catch basin, a vacuum device, and a polishing fluid recycling module for recycling polishing fluid.