公开(公告)号：US20250010431A1

公开(公告)日：2025-01-09

申请号：US18274991

申请日：2022-08-18

Applicant: Applied Materials, Inc.

Inventor： Jianjun HU ,  Peng LIU ,  Colin John DICKINSON ,  Quoc TRUONG ,  Jamie Stuart LEIGHTON ,  Gopalakrishna B. PRABHU ,  John Howard GIVENS

IPC: B24B57/02 ,  B24B37/005 ,  B24B37/04

Abstract: The present disclosure generally relates to methods and system used to collect and reuse polishing fluids used during a chemical mechanical polishing (CMP) process for the fabrication of electronic devices. More specifically, systems and methods provided herein include a polishing fluid collection system having a catch basin, a vacuum device, and a polishing fluid recycling module for recycling polishing fluid.

公开(公告)号：US20220193863A1

公开(公告)日：2022-06-23

申请号：US17430688

申请日：2019-04-04

Applicant: Applied Materials, Inc.

Inventor： Lizhong SUN ,  Peng LIU ,  Jianjun HU

IPC: B24B55/12 ,  B24B57/02 ,  B24B37/00

Abstract: Embodiments of the present disclosure generally provide apparatus for collecting and reuse polishing fluids and methods related thereto. In particular, the apparatus and methods provided herein feature a polishing fluid collection system used to collect and reuse polishing fluids dispensed during the chemical mechanical polishing (CMP) of a substrate in an electronic device manufacturing process. In one embodiment, a polishing fluid catch basin assembly includes a catch basin sized to surround at least a portion of a polishing platen and to be spaced apart therefrom. The catch basin features an outer wall, an inner wall disposed radially inward of the outer wall, and a base portion connecting the inner wall to the outer wall. The outer wall, the inner wall, and the base portion collectively define a trough. A radially inward facing surface of the inner wall is defined by an arc radius which is greater than a radius of the polishing platen the catch basin is sized to surround.