公开(公告)号：US10192765B2

公开(公告)日：2019-01-29

申请号：US14456631

申请日：2014-08-11

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas Baumgarten ,  Nir Merry

IPC: H01L21/67 ,  H01L21/677

Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US20180366355A1

公开(公告)日：2018-12-20

申请号：US16112197

申请日：2018-08-24

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas B. Baumgarten ,  Nir Merry

IPC: H01L21/67 ,  H01L21/677

Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US11450539B2

公开(公告)日：2022-09-20

申请号：US16112197

申请日：2018-08-24

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas B. Baumgarten ,  Nir Merry

IPC: H01L21/67 ,  H01L21/677

Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US11282724B2

公开(公告)日：2022-03-22

申请号：US16534948

申请日：2019-08-07

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas Baumgarten ,  Nir Merry

IPC: H01L21/67 ,  H01L21/677

Abstract: A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.

公开(公告)号：US20220392789A1

公开(公告)日：2022-12-08

申请号：US17821073

申请日：2022-08-19

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas Baumgarten ,  Nir Merry

IPC: H01L21/67

Abstract: An electronic device processing system includes a factory interface (FI), substrate carrier(s), a humidity sensor, an oxygen sensor, and an environmental control system coupled to the FI. A processor of the environmental control system is to cause inert gas to be provided to an FI chamber and inert gas exhausted from the FI chamber to be circulated back into the FI chamber. The processor is also to identify conditions to be satisfied before opening a door of the substrate carriers. The processor is to control the humidity level based on detection by the humidity sensor or the oxygen level based on detection by the oxygen sensor. If the one or more conditions are satisfied, the processor is to open the carrier door to enable passing of substrates between the FI chamber and the substrate carriers.

公开(公告)号：US20150045961A1

公开(公告)日：2015-02-12

申请号：US14456631

申请日：2014-08-11

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas Baumgarten

IPC: G05D23/19

CPC classification number: H01L21/67253 ,  H01L21/67207 ,  H01L21/67248 ,  H01L21/67772

Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

Abstract translation: 描述了包括工厂界面的环境控制的电子设备处理系统。 一个电子设备处理系统具有工厂接口，其具有工厂接口室，耦合到工厂接口的负载锁定装置，耦合到工厂接口的一个或多个衬底载体以及耦合到工厂接口并可操作以监视的环境控制系统 或控制工厂界面室内相对湿度，温度，氧气量或惰性气体的量之一。 在另一方面，提供了工厂接口腔室内的载体净化室的吹扫。 还描述了处理衬底的方法以及许多其它方面。