公开(公告)号：US10192765B2

公开(公告)日：2019-01-29

申请号：US14456631

申请日：2014-08-11

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas Baumgarten ,  Nir Merry

IPC: H01L21/67 ,  H01L21/677

Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US20150090294A1

公开(公告)日：2015-04-02

申请号：US14499121

申请日：2014-09-27

Applicant: Applied Materials, Inc.

Inventor： Edward Ng ,  Jeffrey C. Hudgens ,  Ayan Majumdar ,  Sushant S. Koshti

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/68707 ,  B08B1/00 ,  B65H15/00 ,  B65H43/04 ,  B65H2301/333 ,  B65H2404/651 ,  B65H2405/50 ,  B65H2515/716 ,  B65H2553/20 ,  H01L21/67051 ,  H01L21/67225 ,  H01L21/67778

Abstract: In some embodiments, methods and systems are provided for improved handling of lithography masks including loading a mask via a first load port from a first carrier; inverting the mask using a first contact pad; cleaning the mask; inverting the mask using a second contact pad; and unloading the mask via a second load port into a second carrier. Numerous other aspects are provided.

Abstract translation: 在一些实施例中，提供了用于改进光刻掩模处理的方法和系统，包括经由第一载体从第一载体加载掩模; 使用第一接触垫翻转掩模; 清洁面膜; 使用第二接触垫翻转掩模; 以及经由第二负载端口将所述掩模卸载到第二载体中。 提供了许多其他方面。

公开(公告)号：US11450539B2

公开(公告)日：2022-09-20

申请号：US16112197

申请日：2018-08-24

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas B. Baumgarten ,  Nir Merry

IPC: H01L21/67 ,  H01L21/677

Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

公开(公告)号：US11282724B2

公开(公告)日：2022-03-22

申请号：US16534948

申请日：2019-08-07

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas Baumgarten ,  Nir Merry

IPC: H01L21/67 ,  H01L21/677

Abstract: A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.

公开(公告)号：US10199256B2

公开(公告)日：2019-02-05

申请号：US14499121

申请日：2014-09-27

Applicant: Applied Materials, Inc.

Inventor： Edward Ng ,  Jeffrey C. Hudgens ,  Ayan Majumdar ,  Sushant S. Koshti

IPC: H01L21/687 ,  H01L21/677 ,  H01L21/67 ,  B65H15/00 ,  B65H43/04 ,  B08B1/00

Abstract: In some embodiments, methods and systems are provided for improved handling of lithography masks including loading a mask via a first load port from a first carrier; inverting the mask using a first contact pad; cleaning the mask; inverting the mask using a second contact pad; and unloading the mask via a second load port into a second carrier. Numerous other aspects are provided.

公开(公告)号：US09441792B2

公开(公告)日：2016-09-13

申请号：US14498449

申请日：2014-09-26

Applicant: Applied Materials, Inc.

Inventor： Edward Ng ,  Eric A. Englhardt ,  Travis Morey ,  Ayan Majumdar ,  Steve S. Hongkham

IPC: H01L21/67 ,  F17D1/04

CPC classification number: F17D1/04 ,  C23C14/564 ,  C23C14/568 ,  C23C16/00 ,  C23C16/4401 ,  C23C16/54 ,  H01L21/00 ,  H01L21/67017 ,  H01L21/67196 ,  Y10T137/0318 ,  Y10T137/86292

Abstract: Transfer chamber gas purge apparatus are disclosed. The transfer chamber gas purge apparatus has a transfer chamber adapted to contain at least a portion of a transfer robot, the transfer chamber including side walls, a chamber lid, and a chamber floor, wherein the chamber lid has a plurality of distributed chamber inlets. The plurality of distributed chamber inlets may include diffusing elements. Laminar purge gas flow may be provided above the substrate. Systems and methods including a plurality of distributed chamber inlets are disclosed, as are numerous other aspects.

Abstract translation: 转印室气体净化装置被公开。 传送室气体净化装置具有适于容纳传送机器人的至少一部分的传送室，传送室包括侧壁，室盖和室底板，其中室盖具有多个分布的室入口。 多个分布室入口可以包括扩散元件。 层叠吹扫气流可以设置在衬底上。 公开了包括多个分布式室入口的系统和方法，以及许多其它方面。

公开(公告)号：US20220392789A1

公开(公告)日：2022-12-08

申请号：US17821073

申请日：2022-08-19

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas Baumgarten ,  Nir Merry

IPC: H01L21/67

Abstract: An electronic device processing system includes a factory interface (FI), substrate carrier(s), a humidity sensor, an oxygen sensor, and an environmental control system coupled to the FI. A processor of the environmental control system is to cause inert gas to be provided to an FI chamber and inert gas exhausted from the FI chamber to be circulated back into the FI chamber. The processor is also to identify conditions to be satisfied before opening a door of the substrate carriers. The processor is to control the humidity level based on detection by the humidity sensor or the oxygen level based on detection by the oxygen sensor. If the one or more conditions are satisfied, the processor is to open the carrier door to enable passing of substrates between the FI chamber and the substrate carriers.

公开(公告)号：US20150090341A1

公开(公告)日：2015-04-02

申请号：US14498449

申请日：2014-09-26

Applicant: Applied Materials, Inc.

Inventor： Edward Ng ,  Eric A. Englhardt ,  Travis Morey ,  Ayan Majumdar ,  Steve S. Hongkham

IPC: F17D1/04

CPC classification number: F17D1/04 ,  C23C14/564 ,  C23C14/568 ,  C23C16/00 ,  C23C16/4401 ,  C23C16/54 ,  H01L21/00 ,  H01L21/67017 ,  H01L21/67196 ,  Y10T137/0318 ,  Y10T137/86292

Abstract: Transfer chamber gas purge apparatus are disclosed. The transfer chamber gas purge apparatus has a transfer chamber adapted to contain at least a portion of a transfer robot, the transfer chamber including side walls, a chamber lid, and a chamber floor, wherein the chamber lid has a plurality of distributed chamber inlets. The plurality of distributed chamber inlets may include diffusing elements. Laminar purge gas flow may be provided above the substrate. Systems and methods including a plurality of distributed chamber inlets are disclosed, as are numerous other aspects.

Abstract translation: 转印室气体净化装置被公开。 传送室气体净化装置具有适于容纳传送机器人的至少一部分的传送室，传送室包括侧壁，室盖和室底板，其中室盖具有多个分布的室入口。 多个分布室入口可以包括扩散元件。 层叠吹扫气流可以设置在衬底上。 公开了包括多个分布式室入口的系统和方法，以及许多其它方面。

公开(公告)号：US20150045961A1

公开(公告)日：2015-02-12

申请号：US14456631

申请日：2014-08-11

Applicant: Applied Materials, Inc.

Inventor： Sushant S. Koshti ,  Dean C. Hruzek ,  Ayan Majumdar ,  John C. Menk ,  Helder T. Lee ,  Sangram Patil ,  Sanjay Rajaram ,  Douglas Baumgarten

IPC: G05D23/19

CPC classification number: H01L21/67253 ,  H01L21/67207 ,  H01L21/67248 ,  H01L21/67772

Abstract: Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

Abstract translation: 描述了包括工厂界面的环境控制的电子设备处理系统。 一个电子设备处理系统具有工厂接口，其具有工厂接口室，耦合到工厂接口的负载锁定装置，耦合到工厂接口的一个或多个衬底载体以及耦合到工厂接口并可操作以监视的环境控制系统 或控制工厂界面室内相对湿度，温度，氧气量或惰性气体的量之一。 在另一方面，提供了工厂接口腔室内的载体净化室的吹扫。 还描述了处理衬底的方法以及许多其它方面。

公开(公告)号：US20180350637A1

公开(公告)日：2018-12-06

申请号：US16102670

申请日：2018-08-13

Applicant: Applied Materials, Inc.

Inventor： John J. Mazzocco ,  Edward Ng ,  Douglas MacLeod ,  David Phillips ,  Ayan Majumdar ,  Jeffrey C. Hudgens

IPC: H01L21/673 ,  H01L21/67 ,  G01V8/12

CPC classification number: H01L21/6732 ,  G01V8/12 ,  H01L21/67259

Abstract: Methods, apparatus, and assemblies are provided for a substrate carrier adapter insert including an adapter frame including a support rail adapted to support one or more substrates in a substrate carrier, a frame extension coupled to, or integral with, the adapter frame, and a mapping feature formed on the frame extension and disposed to be detected by a sensor for determining whether an adapter insert is present or absent in a substrate carrier. Numerous additional features are disclosed.