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公开(公告)号：US20190355608A1
公开(公告)日：2019-11-21
申请号：US16381986
申请日：2019-04-11
Applicant: Applied Materials, Inc.
Inventor： Abdul Aziz KHAJA , Jun MA , Hyung Je WOO , Fei WU , Jian LI
IPC: H01L21/683 , H01L21/67
Abstract: A substrate support is disclosed. The substrate support has a dielectric body with a plurality of features formed thereon. A ledge surrounds the plurality of features about a periphery thereof. The features increase in number from a central region of the substrate support towards the ledge. A seasoning layer is optionally disposed on the dielectric body.
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