公开(公告)号：US20220098729A1

公开(公告)日：2022-03-31

申请号：US17034937

申请日：2020-09-28

Applicant: Applied Materials, Inc.

Inventor： Fei WU ,  Abdul Aziz KHAJA ,  Amit Kumar BANSAL ,  Tuan Anh (Mike) NGUYEN ,  Qian SUI

IPC: C23C16/44 ,  C23C16/40 ,  C23C16/34 ,  C23C16/455 ,  H01J37/32

Abstract: The present disclosure relates to a method for cleaning one or more chamber components having contaminants. The method includes introducing a gas mixture to a remote plasma source, the gas mixture includes argon, an oxygen-containing gas and a nitrogen-containing gas. The argon to oxygen gas ratio in the gas mixture is about 0.2:1 to about 1:1 by volume. A plasma is formed from the gas mixture in the remote plasma source. The plasma includes oxygen radicals, argon radicals, and nitrogen radicals. The plasma is introduced to a process volume of the process chamber and exposes surfaces of one or more chamber components. The process volume of the process chamber has a pressure of about 10 mTorr to about 6 Torr and a temperature above 300° C.

公开(公告)号：US20190355608A1

公开(公告)日：2019-11-21

申请号：US16381986

申请日：2019-04-11

Applicant: Applied Materials, Inc.

Inventor： Abdul Aziz KHAJA ,  Jun MA ,  Hyung Je WOO ,  Fei WU ,  Jian LI

IPC: H01L21/683 ,  H01L21/67

Abstract: A substrate support is disclosed. The substrate support has a dielectric body with a plurality of features formed thereon. A ledge surrounds the plurality of features about a periphery thereof. The features increase in number from a central region of the substrate support towards the ledge. A seasoning layer is optionally disposed on the dielectric body.