公开(公告)号：US12198944B2

公开(公告)日：2025-01-14

申请号：US17202245

申请日：2021-03-15

Applicant: Applied Materials, Inc.

Inventor： Brian J. Brown ,  Ekaterina Mikhaylichenko ,  Jin Ji ,  Jagan Rangarajan ,  Steven M. Zuniga

IPC: H01L21/67 ,  B24B41/06

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) systems, and more particular, to modular polishing systems used in the manufacturing of semiconductor devices. In one embodiment, a polishing system includes a first portion having a plurality of polishing stations disposed therein, and a second portion coupled to the first portion, the second portion comprising a substrate cleaning system. The substrate cleaning system comprises a wet-in/dry-out substrate cleaning module comprising a chamber housing which defines a chamber volume. The polishing system further includes a substrate handler located in the second portion, where the substrate handler is positioned to transfer substrates to or from the wet-in/dry-out substrate cleaning module through one or more openings formed in one or more sidewalls of the chamber housing.