公开(公告)号：US20180213608A1

公开(公告)日：2018-07-26

申请号：US15411896

申请日：2017-01-20

Applicant: Applied Materials, Inc.

Inventor： David Benjaminson ,  Ken Schatz ,  Dmitry Lubomirsky

IPC: H05B3/34 ,  H01L21/67 ,  H01L21/683

CPC classification number: H05B3/34 ,  H01L21/67103 ,  H01L21/6833 ,  H05B2203/013 ,  H05B2203/017

Abstract: A heater assembly for a substrate support assembly includes a flexible body. The heater assembly further includes one or more resistive heating elements disposed in the flexible body. The heater assembly further includes a first metal layer disposed on the top surface of the flexible body and extending at least partially onto an outer sidewall of the flexible body. The heater assembly further includes a second metal layer disposed on a bottom surface of the flexible body and extending at least partially onto the outer sidewall of the flexible body, wherein the second metal layer is coupled to the first metal layer at the outer sidewall of the flexible body such that the first metal layer and the second metal layer enclose, and form a continuous electrically conductive path around, the outer sidewall of the flexible body.