公开(公告)号：US20140105583A1

公开(公告)日：2014-04-17

申请号：US14043091

申请日：2013-10-01

Applicant: Applied Materials, Inc.

Inventor： JOSEPH JOHNSON ,  JOSEPH M. RANISH ,  JOHN GERLING ,  MATHEW ABRAHAM ,  AARON MUIR HUNTER ,  ANEESH NAINANI

IPC: H01L21/67

CPC classification number: H01L21/67115 ,  H01L21/67103 ,  H01L21/67109

Abstract: Apparatus for providing heat energy to a process chamber are provided herein. The apparatus may include a process chamber body of the process chamber, a solid state source array having a plurality of solid state sources, disposed on a first substrate, to provide heat energy to the process chamber to heat a target component disposed in the process chamber body, and at least one reflector disposed on the first substrate proximate to one or more of the plurality of solid state sources to direct heat energy provided by the one or more of the plurality of solid state sources towards the target component.

Abstract translation: 本文提供了用于向处理室提供热能的设备。 该装置可以包括处理室的处理室主体，具有多个固态源的固态源阵列，其设置在第一基板上，以向处理室提供热能，以加热设置在处理室中的目标部件 主体和至少一个反射器，其布置在靠近所述多个固态源中的一个或多个固态源的第一基板上，以将由所述多个固态源中的一个或多个的所述固态源提供的热能引导到所述目标部件。