公开(公告)号：US20160131352A1

公开(公告)日：2016-05-12

申请号：US14538733

申请日：2014-11-11

Applicant: APPLIED MATERIALS, INC.

Inventor： SRISKANTHARAJAH THIRUNAVUKARASU ,  JOSEPH JOHNSON

IPC: F21V23/06 ,  F21V19/00 ,  F21V29/89 ,  F21K99/00 ,  F21V23/02

CPC classification number: H05K1/112 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10303

Abstract: Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include a base having a plurality of vias formed in a bottom surface of the base, and wherein an electrical connector is disposed in each via, a first metallic layer disposed on a top surface of the base and electrically coupled to the electrical connectors disposed in the plurality of via, and a plurality of solid state light sources disposed on a top surface of the metallic layer and electrically coupled to the metallic layer.

Abstract translation: 本文提供了用于在处理室中提供脉冲或连续能量的装置。 该设备可以包括具有形成在基座的底表面中的多个通孔的基座，并且其中电连接器设置在每个通孔中，第一金属层设置在基座的顶表面上并电耦合到电连接器 设置在所述多个通孔中，以及多个固态光源，其设置在所述金属层的顶表面上并电耦合到所述金属层。

公开(公告)号：US20140241707A1

公开(公告)日：2014-08-28

申请号：US13778991

申请日：2013-02-27

Applicant: APPLIED MATERIALS, INC.

Inventor： JOSEPH JOHNSON ,  JOSEPH M. RANISH

IPC: H01L21/67 ,  H01L33/08

CPC classification number: H01L25/0753 ,  H01L33/60 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0066 ,  H01L2924/00

Abstract: Apparatus for providing pulsed or continuous energy in a process chamber, and methods of fabricated said apparatus, are provided herein. The apparatus may include a substrate having a plurality of electrical terminals disposed on one or more surfaces of the substrate, a plurality of solid state sources grown on top of the plurality of electrical terminals, the plurality of solid state sources providing pulsed or continuous energy when electrically powered, and one or more cooling channels formed in one or more areas of the substrate.

Abstract translation: 在处理室中提供脉冲或连续能量的装置，以及制造的所述装置的方法。 该装置可以包括具有设置在基板的一个或多个表面上的多个电端子的基板，在多个电端子的顶部上生长的多个固态源，多个固态源提供脉冲或连续的能量，当 电动的，以及形成在衬底的一个或多个区域中的一个或多个冷却通道。

公开(公告)号：US20140238970A1

公开(公告)日：2014-08-28

申请号：US13779004

申请日：2013-02-27

Applicant: APPLIED MATERIALS, INC.

Inventor： JOSEPH JOHNSON ,  JOHN GERLING ,  KLAUS SCHUEGRAF

IPC: H05B3/00 ,  H05B35/00

CPC classification number: H05B3/0038 ,  H01L21/67115

Abstract: Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include a lamphead including a set of lamps, wherein the first set of lamps are not solid state light sources, and a set of solid state light sources disposed on the lamp head, to provide pulsed or continuous energy to the process chamber.

Abstract translation: 本文提供了用于在处理室中提供脉冲或连续能量的装置。 该装置可以包括包括一组灯的灯头，其中第一组灯不是固态光源，并且一组固态光源设置在灯头上，以向处理室提供脉冲或连续的能量。

公开(公告)号：US20140270735A1

公开(公告)日：2014-09-18

申请号：US14182879

申请日：2014-02-18

Applicant: APPLIED MATERIALS, INC.

Inventor： JOHN GERLING ,  JOSEPH M. RANISH ,  OLEG V. SEREBRYANOV ,  JOSEPH JOHNSON

IPC: H01L21/02

CPC classification number: H01L21/67115 ,  C23C14/541 ,  C23C16/46

Abstract: Apparatus for providing pulsed or continuous energy in a process chamber are provided herein. The apparatus may include: a process chamber body of the semiconductor process chamber; one or more solid state source arrays providing pulsed or continuous energy to the process chamber, wherein each of the one or more solid state source arrays include a substrate having a plurality of solid state light sources disposed on a first surface of the substrate, wherein the plurality of solid state light sources are connected in series and in a recursive pattern on the first surface of the substrate, and a heat sink coupled to a second surface of the substrate configured to remove heat from the substrate; and a power source coupled to the one or more solid state source arrays to electrically power the plurality of solid state sources.

Abstract translation: 本文提供了用于在处理室中提供脉冲或连续能量的装置。 该装置可以包括：半导体处理室的处理室主体; 一个或多个固态源阵列向处理室提供脉冲或连续的能量，其中所述一个或多个固态源阵列中的每一个包括设置在所述基板的第一表面上的多个固态光源的基板，其中， 多个固态光源在衬底的第一表面上串联连接并以递归图案连接，散热片耦合到衬底的第二表面，该第二表面构造成从衬底移除热量; 以及耦合到所述一个或多个固态源阵列以对所述多个固态源供电的电源。

公开(公告)号：US20140105583A1

公开(公告)日：2014-04-17

申请号：US14043091

申请日：2013-10-01

Applicant: Applied Materials, Inc.

Inventor： JOSEPH JOHNSON ,  JOSEPH M. RANISH ,  JOHN GERLING ,  MATHEW ABRAHAM ,  AARON MUIR HUNTER ,  ANEESH NAINANI

IPC: H01L21/67

CPC classification number: H01L21/67115 ,  H01L21/67103 ,  H01L21/67109

Abstract: Apparatus for providing heat energy to a process chamber are provided herein. The apparatus may include a process chamber body of the process chamber, a solid state source array having a plurality of solid state sources, disposed on a first substrate, to provide heat energy to the process chamber to heat a target component disposed in the process chamber body, and at least one reflector disposed on the first substrate proximate to one or more of the plurality of solid state sources to direct heat energy provided by the one or more of the plurality of solid state sources towards the target component.

Abstract translation: 本文提供了用于向处理室提供热能的设备。 该装置可以包括处理室的处理室主体，具有多个固态源的固态源阵列，其设置在第一基板上，以向处理室提供热能，以加热设置在处理室中的目标部件 主体和至少一个反射器，其布置在靠近所述多个固态源中的一个或多个固态源的第一基板上，以将由所述多个固态源中的一个或多个的所述固态源提供的热能引导到所述目标部件。