公开(公告)号：US20240404893A1

公开(公告)日：2024-12-05

申请号：US18677184

申请日：2024-05-29

Applicant: Applied Materials, Inc.

Inventor： Shih-Hao KUO ,  Shih-Hsien LEE ,  Thomas L. LAIDIG ,  Jang Fung CHEN ,  Min Sheng SUEN

IPC: H01L21/66 ,  H01L23/495

Abstract: Embodiments of the present disclosure generally relate to lithography systems. In one embodiment, a method is disclosed. The method includes measuring a location of a die pad of a die placed on a substrate and determining a die pad shift between an expected location of the die pad and the measured location of the die pad. The method also includes using the determined die pad shift and an expected via location to generate a shifted via location for a via electrically connecting to the die pad. The method further includes patterning the via at the shifted via location with a maskless lithography tool and utilizing a physical mask with a mask-based lithography tool to pattern a redistribution layer (RDL) pad electrically connected to the via patterned at the shifted via location with the maskless lithography tool.