公开(公告)号：US20240234108A1

公开(公告)日：2024-07-11

申请号：US18403982

申请日：2024-01-04

Applicant: Applied Materials, Inc.

Inventor： Paneendra Prakash Bhat ,  Qiwei Liang ,  Douglas Buchberger ,  Dmitry Lubomirsky ,  Naveen Kumar Nagaraja ,  Vijay D. Parkhe

IPC: H01J37/32 ,  G03F7/00 ,  G03F7/38 ,  H01L21/683

CPC classification number: H01J37/32724 ,  G03F7/38 ,  G03F7/70708 ,  H01J37/32642 ,  H01L21/6833 ,  H01J2237/002 ,  H01J2237/2007

Abstract: Exemplary substrate support assemblies may include an electrostatic chuck body defining a substrate support surface that defines a substrate seat. The electrostatic chuck body may define a backside gas lumen that extends through a surface of the substrate seat. The assemblies may include a bias electrode coupled with the electrostatic chuck body. The bias electrode may include a plurality of conductive mesas that protrude upward across the substrate seat. The assemblies may include a support stem coupled with the electrostatic chuck body. The assemblies may include at least one chucking electrode embedded within the electrostatic chuck body. The assemblies may include at least one heater embedded within the electrostatic chuck body.

公开(公告)号：US11769684B2

公开(公告)日：2023-09-26

申请号：US18080421

申请日：2022-12-13

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Vijay D. Parkhe ,  Naveen Kumar Nagaraja ,  Sanjeev Baluja ,  Surajit Kumar ,  Dhritiman Subha Kashyap ,  Ashutosh Agarwal

IPC: H01T23/00 ,  H01L21/683 ,  H01L21/67 ,  C23C16/458 ,  C23C16/455

CPC classification number: H01L21/6833 ,  C23C16/4585 ,  C23C16/4586 ,  H01L21/67103 ,  H01L21/67248 ,  C23C16/45544

Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.

公开(公告)号：US20230113057A1

公开(公告)日：2023-04-13

申请号：US18080421

申请日：2022-12-13

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Vijay D. Parkhe ,  Naveen Kumar Nagaraja ,  Sanjeev Baluja ,  Surajit Kumar ,  Dhritiman Subha Kashyap ,  Ashutosh Agarwal

IPC: H01L21/683 ,  H01L21/67 ,  C23C16/458

Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.

公开(公告)号：US20210111059A1

公开(公告)日：2021-04-15

申请号：US17066974

申请日：2020-10-09

Applicant: Applied Materials, Inc.

Inventor： Tejas Ulavi ,  Vijay D. Parkhe ,  Naveen Kumar Nagaraja ,  Sanjeev Baluja ,  Surajit Kumar ,  Dhritiman Subha Kashyap ,  Ashutosh Agarwal

IPC: H01L21/683 ,  C23C16/458 ,  H01L21/67 ,  C23C16/455

Abstract: Substrate supports comprising a plurality of bonded plates forming a single component support body and methods of forming the substrate supports are described. The single component support body has an outer peripheral edge, a top surface and a bottom surface. A pocket is formed in the top surface and has a bottom surface, a depth and an outer peripheral edge. A purge ring is spaced a distance from the outer peripheral edge and comprises at least one opening in the top surface in fluid communication with a purge gas line within the body thickness.